United States
- Leading development of integration and packaging for ultra-high density Neural probes -Si Microfluidics integration for Organ on Chip applications - Transferred MEMS/ TFT Integration tech to LCD Fab partner to enable large area ultrasound monitoring patches for cardiac applications. - Internal consultant for Semiconductor, MEMS and Bioelectronics packaging solutions. - Internal Engineering and operations Advisor for number of Pre Seed / Series A IMEC Spinoffs
Build from ground up Engineering/ LVM line and Ops/Engg teams developing electronically switchable lenses for Ophthalmic/ MedTech/ AR / VR applications. - Set up engineering and process development teams for manufacturing of electro-switchable lenses - Developed strategic supplier partnerships to outsource flexible electronics, nanoimprinting, 3D print/ electronic frame manufacturing technologies. - Drove process development , yield / throughput improvement for internal eProgressive lens manufacturing and product assembly. - Led a team of system engineers, industrial designers and eyewear manufacturers to develop 3D printed electronic frames for e-eyewear
- Product owner of flip chip products for Server, Networking, Mobile Communications and Automotive. - Successfully collaborated with customer and factory in multiple product qualifications -Flip Chip BGA, SiP and 2.5 TSV based Si Interposer products for ASIC/ FPGA/GPU applications. -Ultra thin TMV PoP fcCSP and lidded fcCSP products for mobile SOC applications. - Managed multiple Fabless and IDM customer accounts as the key business and technical interface. - Extensive experience in supplier qualification, yield and quality improvement. - Championed aggressive cost reduction with continuous yield improvement and BOM standardization. - Key role in winning new business opportunities for flip chip product line as the pricing decision maker
Packaging related developments for 3D TSV Integration, CMOS Imagers, MEMS, GaN on Si LED, Power electronics and Bio-electronics applications. - Project management for 3D TSV packaging projects - Test chip/ package designs for process development and reliability. - Enabled proof-of-concept projects as integration engineer - Developed supply chain collaborations with equipment, material vendors and OSATS for packaging applications. - Thermomechanical Finite Element Simulations for package deformation and solder joint stress analysis - Developed crack growth models for solder fatigue life predictions - Material characterization of creep properties of lead free solders for FEA Models. - Solder joint performance evaluation in extreme low temperature environments for high reliability applications.
Process development, reliability and failure analysis of SAW filter modules