Canada
-SI/RF lead for a high-speed backplane product line from designing, model-correlation, setting limit line to qualify high-volume manufacturing -High-speed interconnect design 112-224G including backplane connector/cable assembly/PCB break-out, via-modelling, HDI board characterization, near-chip interconnect for CPU and GPU in data centre, switch, router applications -Lead and define industry 1st cartridge-level PCIe 5/6 and ethernet BERT system for AI-data centre and work cross-functionally with product, mechanical, manufacturing, and architecture teams internationally -Technical lead for 1st tier hyperscalers for providing EM modelling and architecture design, and road-map discussion -Drive SI testing verification and characterization methodologies with VNA, TDR and BER testing etc.. -Lead 2nd source efforts with our industrial partners including product spec. definition, verification testing methodologies, modelling to ensure our competitiveness -Big data statistical analysis using six sigma methodologies with MATLAB and JMP for BER analysis -Represent TE externally through technical report and conferences
-Package lead for augmented reality glasses chipsets including the processing and display chipsets for electrical, thermal and mechanical aspects from concept to manufacturing production -Drove SI/PI architecture requirements and simulation methodology/analysis in different MIPI consumer products with cross-functional teams (system/analog/digital/EE systems/display) -Optimized PDN analysis with end-to-end consideration -Simulated and optimized end-to-end SI package/PCB/flexible substrate for systems, with circuit and 3D-EM simulators, in both frequency and time domain (IBIS AMI model) -Led floor plan optimization with stringent physical package bump, layout size, current limit, power plane, warpage etc. -Led custom ASIC photodiode end-to-end verification in electrical to optical domain in different packaging solutions -Conducted packaging analysis and collaborate with global packaging vendors, and presented the state-of-the-art advanced packaging technologies, materials, substrate to different stakeholders -Wrote RFI proposals on optimizing the RFFE system performance to reduce improve link budget
-Developed advanced technology and strategic project planning including wireless/antenna/optical business units. -Provided technical advice for R&D teams and manage different end-to-end, cutting edge wireless projects to drive business values -Led partnership for new start-ups and universities globally with our customers for next generation research opportunities -Negotiated technical research IP licensing/patent agreements with different stakeholders -Closely worked with directors to define research roadmap and project chartering
-Designed ultra-wideband passives using 7nm CMOS technology -Worked on the electrical modeling, validation of package and PCB board design -Developed high frequency post-silicon bring up test plans to validate SI and provide root-cause analysis for DOE/DFM/DFT -Conducted advanced package routing feasibility and its interconnects simulations for high-speed/frequency design -Optimized with the digital/system/analog team in bumpout/floor plan/die size for an optimal package solution -Evaluated 2.5D MCM and 3D package solution including optimizing the processes, wafer bumps and substrate design rules -Drove the key mechanical profile and electrical models for bumps/BGA balls for improving system level performance -Developed new package/system guidelines/specifications for analog/system/testing/application teams to ensure PPA is achieved -Built an automatic process for package verification between die and package level for high I/O serdes -Led custom-made IC socket for testing 100GHz+ serdes and evaluated vendors with cost analysis -Evaluated silicon photonic IC package (EIC+PIC) with different approaches of coupling with MZM optimization -Liaised closely with global vendors to develop new product prototypes and presented to local teams
-Manage KPI/Metrics for the Department of Marketing Solution Sales (MSSD) in all tiers of carrier-network business -Facilitate sales planning and management for all business departments including Wireless, Wireline, IT and Services (sales forecast/targets, demand forecast, in-depth sales, market and gap analysis) for executives -Facilitate project budgeting, status tracking, risk analysis, mitigation -Analyze sales progress/pace and make the recommendation for future objectives to ensure profitability and revenue growth -Promote and implement new product introduction (NPI) program (direct work with vice-presidents, business unit directors, product managers, R&D department) -Comply, manage and implement bonus schemes for key strategic projects -Facilitate business operations (regular business reports, sales meeting, strategic plan, and business plan) -Analyze ROI and TCO for different projects
Research Interests: Integrated tunable RF devices and high-Q passive circuits, passive RF circuit models, RF MEMS designs, RFIC modeling •Development of Tunable RF Integrated Passive Devices (IPDs) and its MEMS Fabrication Process -Designed, fabricated and tested some novel on-chip impedance tuner, high-Q tunable filters, power divider,phase shifter and wideband balun for GSM/UMTS/LTE/BT/WLAN/IoT front end multi-chip module /system-in-package (MCM/SIP) applications. -Material characterization, packaging, reliability testing and passive circuit-model extraction -In-depth knowledge in high-Q RF varactor, BST, RF MEMS and their characterization and modeling -Designed and characterized high-Q tunable RF devices with industrial partners ON Semiconductor and Huawei Technologies LTD -Designed high-Q capacitor bank • Modeling of a Piezoelectric Micro-Power Generator/Sensor -Experienced in analytical, electrical and finite element model for micro cantilever-beam structure including mode shape, maximum deflection and electrical-mechanical power conversion -Analyzed the transient response of energy-harvesting sensor, nonlinear effect in multi degree-of-freedom movement, equations of motion, stress gradident •30 GHz Variable Attenuator Using VO2 Materials for 5G Applications -Led the design for a 20-dB variable attenuator for wideband millimetre-wave applications •Tunable Low-loss True-time Delay (TTD) Networks using IPD/MEMS Technology for Full Duplex Radio Chip -Designed and fabricated a TTD network with less than 1ps fine control time-delay •UW-MEMS Multi-user Microfabrication Team -Provided in-house cleanroom fabrication service and advice for internal/external customers -Strong hands on experience in RF measurement as well as PCB/WLCSP/Flip-chip/QFN/SMT technology. -Trained new users for using clean room facilities such as mask aligner, PECVD, sputtering and RIE. -Developed an in-house thick metal electroplating system and its fabrication recipe.
Being a TA for a wide range of programs which cover department of Electrical and Computer Engineering, Mechatronics and Mechanical Engineering, Chemical, Civil, Environmental, Geological and Management Engineering from 1st-4th year undergraduate students: -Supervised and prepared laboratory work -Debugged PCB errors and trained students to use different equipment such as signal generator, oscilloscope, LCR meter and spectrum analyzer -Prepared robotic project that involves optical encoder, thermistor, hall effect sensor, active filter and current sensor, photo-diode and trans-impedance amplifier from theory to demonstration -Designed and tested a line-follower by using photo-diode to detect infrared light from LED with difference amplifiers using C -Built power management circuit using current sensing with PWM signal from microcontroller -Gave weekly tutorial sessions, prepared material for lecture and provided advice for national robot competition And the courses are: •ECE 431 Radio Frequency Microelectronics •ME 269 Electromechanical Devices and Power Processing •MTE 220 Sensors and Instrumentation •ECE 140 Linear Circuits •ECE 126 Introduction to Electrostatics, Magnetism and Electronics •ECE 106 Physics of Electrical Engineering 2 •GENE 123 Electrical Engineering Course Description Details: http://ugradcalendar.uwaterloo.ca/page/Course-Descriptions-Index#E