Ann Arbor, Michigan, United States
Senior Quantum Materials Scientist specializing in solid-state spin defects, coherence engineering, and scalable quantum sensing hardware. PhD in Materials Science and Engineering with expertise in semiconductor thin films, nanofabrication, defect control, and heterostructure integration. Experienced in translating defect-engineered materials into device-level platforms, including spin-based sensing systems, ODMR architectures, and integrated microwave/RF structures (e.g., CPW antennas). Proven track record of delivering functional prototypes aligned with defined performance KPIs, closing gaps between laboratory demonstrations and manufacturable hardware solutions. Background includes thin-film process development, interface reliability, RF integration, and cross-functional execution across materials, device, and systems teams. Quantum Sensing Experience: Qubit Syntheses, optical readout, CAD Layout, Microwave/RF Antenna design, Sensor-Device Integration, Diamond NV center CW ODMR system, Python for Data Analyses Materials Processing Experience: Plasma Enhanced Chemical Vapor Deposition (PECVD) thin film growth, dry and wet etch, thermal evaporation, E-beam evaporation, sputtering, photolithography, E-beam lithography, lift-off, optical Metrology and Ellipsometry. Materials Characterization: mechanical tests & failure analysis, FTIR, DSC, TGA, UV-Vis, Raman/PL, XRD, XPS, SEM/TEM, scanning probe microscopy (AFM, PFM, PiFM, KPFM, c-AFM, TERS/TEPL) Computer and Programming: Origin, K-Layout, COMSOL Multi physics, Python, ANSYS Lumerical FDTD
1. Delivered spin-based quantum sensor prototypes using boron-vacancy (VB⁻) qubits in hBN, achieving 30% ODMR contrast and sub‑10 μT sensitivity for automotive and semiconductor applications. 2. Designed and fabricated nanostructured plasmonic CPW architectures, improving qubit quantum yield 10×, integrating coherent control and PL enhancement to bridge materials research with device-level performance. 3. Applied strain engineering and Purcell effect techniques to optimize qubit coherence and reproducibility, closing performance gaps between prototypes and scalable hardware modules. 4. Executed advanced materials characterization (ODMR, PL, AFM, KPFM, TRPL) to validate sensor performance against KPIs, enabling downstream engineering integration and client evaluation. 5. Led cross-functional efforts to translate 2D materials, thin films, and nanofabrication techniques into manufacturable quantum hardware, aligning technical innovation with product deliverables.
1. Fabricated advanced metasurfaces by depositing a-Si, SiC, and SiN thin films using PECVD, magnetron sputtering, and PLD, followed by photolithography and RIE, achieving 20% improved light-matter coupling for quantum and IR device applications. 2. Engineered dielectric properties by controlling oxygen vacancy formation in α-MoO₃ via hot-pressing, enabling 20% shift in permittivity and 13% tuning of phonon-polariton lifetimes. 3. Developed single-photon emitter-enabled metasurfaces, achieving a g(2) correlation of 0.28, bridging advanced materials design with potential quantum platform integration. 4. Designed and operated a high-pressure Diamond Anvil Cell (DAC) system for in-situ PL and Raman characterization, enabling predictive modeling of material behavior under extreme conditions. 5. Applied strain engineering for bandgap tuning, achieving 650% modulation (0.35–2.65 eV) to enable next-generation mid-IR and optoelectronic applications.
1. Managed the Tübitak project on the development of mid-Infrared photodetectors based on Black Phosphorous (BP). 2. Engineered 2D selenium nanosheets through hot-pressing to induce polymorphic phase transitions, resulting in ultra-narrow linewidth (330 ± 90 µeV) photoemission and controllably enhanced defect density. 3. Enhanced ultrafast photodetection efficiency in black phosphorus-based IR photodetectors by 25% through strategic failure mode analysis and device reconfiguration. 4. Developed a vacuum-tube hot-pressing protocols to achieve ultra thin germanium flakes with process-driven band gap engineering. This resulted in blue spectral PL emission through quantum confinement effect.
1. Developed Hot-pressing mechanism that thermo-mechanically squashes bulk materials to realize ultrathin quasi-2D materials. 2. Established the strain engineering mechanism to alter intrinsic properties of 2D materials. 3. Worked on safety issues of lithium metal anode by superficial surface alloying. 4. Improved the Piezoelectric performance of 2D ferroelectric polymer (PVDF) Flakes up to 6-fold via thermo-mechanical treatment.
Delivering high school physics lectures, while supervising high school physics lab experiments.