Portland, Oregon, United States
Currently Intel Integration Engineer (baking but chips and modules instead of cakes and ingredients) Previously I got my Ph.D. @ UChicago working on nanomanufacturing materials and processes for 28 nanometer and lower full pitch features. I have 4+ years of cleanroom process development experience (Litho, Dep, Etch), and am also experienced in metrology (AFM, SEM, XRay Scattering), and the necessary computer analysis to extract meaningful metrics (LER, LWR, EPR, etc) using python and/or matlab. The core of my research focuses on new methods and materials for Directed Self-Assembly (DSA), an alternative lithography approach that allows for large (EG 82 nm pitch) lithographically defined templates to be converted into much smaller (EG 28 nm pitch) features without any additional exposure or etch steps. Previously I received my undergraduate degree in Chemical Engineering from North Carolina State University where I studied siloxane systems within the Genzer group where I was actively researching polymer synthesis for 4 years.
Connecting engineers with problem statements to engineers with solutions. Model based problem solving. Drawing rectangles in PowerPoint and finding schemes to make the silicon match. Pre design rule to store shelves. Fin to interconnects you could draw with a sharpened pencil and some fun bits in between. multiple divisional awards, 8 filed patents
Defects Bad. Yield Good. Worked on daily task force to make the former go down and the latter go up
When two molecules are dissimilar they will try to phase separate, which is especially true for larger molecules like polymers. By tethering two blocks of dissimilar polymer together this phase separation can only occur at the length scale of the molecule which we call a block copolymer. By presenting the right chemical and topographic cues on a wafer we can direct this assembly to form feature from 50 nms to sub 10 nm in a process called Directed Self-Assembly (DSA). I obtained my PhD in the Nealey Group working on new methods and materials for the DSA process.
Responsible for managing and maintaining UHV Sputtering Systems, and RIEs during an interim period.
Creation of novel silicone polymers and networks. Identification of chemical precursors by collecting and analyzing GC-MS data. Gel analysis conducted via DMTA.
Performed UV reactions, utilized separatory techniques, and identified products with H NMR, C NMR.