Somerset, New Jersey, United States
Sales and Marketing professional with over 23 years of experience in high technology. Able to bridge engineering, technology, and marketplace to identify compelling new opportunities. Experienced in Nanotechnology (SEM, TEM, FIB, BIB), MOCVD (LEDs, solar cells, power electronics, lasers), compound semiconductors, semiconductors, semiconductor equipment (Etch), optical imaging, optical metrology. Proficient working with cross functional teams. Accomplished at building, leading, and motivating teams. Skillful at aligning technology to worldwide markets. Seasoned creative problem solver with strong sales, marketing, and engineering background. Experienced with start-up at Timbre Technologies, a subsidiary of Tokyo Electron. Strong acumen for identifying new revenue opportunities. Passionate in penetrating and expanding business in new opportunities against baseline products/process/tools of record. Demonstrated history of solidifying company position by expanding new product business leading to product proliferation and propagation. Specialties: SEM TEM STEM FIB BIB LED Solar cPV Power Electronics MOCVD Equipment Semiconductor Equipment Etch Thin Film Optical Metrology Defect Inspection Process Engineering Engineering Management Applications Engineering and Management Project Management Account Management Product Management including New Product Introduction New Technology Introduction, Proliferation, Propagation Business Development Strategic Marketing and Sales Regional Management
Oversee the most competitive territory for Nanotechnology Systems Division. Results oriented strategies implemented and executed increased market share. Track record of successes in competitive situations. Identified and passionately pursued new sales opportunities through self driven research while leveraging excellent relationship with customers and suppliers. Worked in close collaboration with distributors. Maintained sales stream of existing customers ensuring repeat business while always pursuing and identifying new opportunities to increase revenue and expand business.
Managed US, Europe, and Japan. Oversaw marketing, business development, and sales for MOCVD BU. Improved market share from 35% to 65% on average across the regions. Instrumental in increasing revenue from $30 million to $65 million. Set pricing for all MOCVD equipments ensuring healthy margins. Achieved highest gross margin within the team. Negotiated terms and conditions of the PO. Process and Demo qualification specifications were reviewed and aligned with field sales. Success criterias were established to ensure its reachable, meetable, and achievable based on data. Bookings and shipments were tracked and followed with actions taken to ensure accurate and proper quarterly recognition. Drove engineering to improve hardware and software CIP programs to align with customer's needs and requirements to meet and exceed overall value including COO and Capex Efficiency metrics against competitor's tools. Owned new product evaluation at key accounts.
Self-driven, analytical, astute, in charge of all facets of developing, propagating, proliferating Litho, Etch, and Thin Film metrology applications space using Scatterometry. Optical Digital Profilometry (ODP), a TEL non-destructive Scatterometry metrology to simultaneously obtain device thickness, CD, and profile information in real-time, has been successfully developed and proven with lowest cost of ownership at virtually all semiconductor device companies (logic and memory) in US and around the world. Technically sound, yet commercial minded, interacted with customers and key decision makers to identify customer’s specific needs while working with sales, marketing, and R&D teams to address those needs in product improvements. Implemented/developed customer applications solutions in alignment with customer device/product roadmap. Assisted account management and marketing teams with sales forecasts, pricing negotiations, and marketing/presentation activities. Knowledge of full device integration/flow of logic and memory devices across customers’ broad product base enabled maximum ODP penetration and adoption.
Orchestrated and oversaw expansion of east coast accounts working in conjunction with Etch and Clean Track Business Units to increase market share for Integrated Metrology on TEL process tools. Managed a direct report. Assisted account management and marketing teams with sales forecasts, pricing negotiations, and marketing/presentation activities. Increased onsite ODP application space through identification and implementation of new applications enabling value/advantageous differentiation against solutions of competitors. Customers’ technical needs/requirements were addressed/aligned with factory. Developed new metrology solutions for Etch, Litho, and Thin Film applications for 65nm and 45nm device nodes. Identified and targeted key customer decision makers and key engineers to become allies in promoting TEL solutions.
Penetrated, expanded, and solidified TEL’s ODP position at Samsung, Hynix, TSMC, and UMC. Helped increased install base from initial product evaluation and adoption of first systems to becoming customer baseline tools of record against initial baseline tool of record and industry’s largest metrology vendor KLA-Tencor. Helped support sales forecasts, and sales and marketing activities for Korean accounts. Sought and identified new applications in integration flow where ODP can differentiate and bring higher value against competition while reducing/minimizing cost for customers. Contributed to significant increase in revenue recognition through identification and implementation of new applications in Flash and DRAM memory fabrication processes while increasing market share against competition.
Central Region Lead, managed all aspects of advanced etch process development and sustaining support for central region. Established robust advanced processes and ramped newly developed processes into high volume manufacturing with excellent yield. Ensured customers’ development team smooth transition to manufacturing of delivery performance metrics across multiple device technologies. Addressed process window and device reliability issues. Helped drive yield enhancement issues. Developed unit processes to meet customers’ technical requirements. Possess excellent technical knowledge of device and plasma physics as it relate to process performance across different dielectric etch equipments. Instituted in-situ ash and wafer-less plasma cleans improving MTBC by ~100 to 200% depending on process chemistry. Implemented CIP projects to improve yield, increase consumable lifetimes, and to minimize scrap. Used DOE characterizations to understand/improve process window. Focused on tightening SPC limits to improve chamber matching within the tool and within fleet.
Lead BEOL etch process development and sustaining support for Motorola (later Freescale), Sematech, and Samsung. Developed DRM and SCCM RIE Cu interconnect etch processes. Developed processes for BEOL oxide and low-k dielectric materials (spin on and deposition). Addressed and solved process and yield enhancement issues related to polymer, particles, and contamination. Evaluated various integration/fabrication schemes. Resolved reliability issues during development and manufacturing. Experienced with broad range of chemistries and recipes. Achieved customer target electrical/parametric results at short and full loop device levels. Developed processes of new devices and ramped these devices into high volume manufacturing. Utilized DOEs to characterize surface response and process windows. Scaled up 200mm production processes for use on 300mm tool sets.
Diligent and dedicated, worked in overseeing system build, integration and test modules. Became proficient in working with various Etch systems. Streamlined chamber build, integration, and final test modules to reduce cost, improve manufacturing process efficiency, and increase throughput.