Michael Hosch

Head of Reactive Etching Processes bei ZEISS Semiconductor Manufacturing Technology

Oberkochen, Baden-Württemberg, Germany

About

Experience

  • Head of Reactive Etching Processes | Manager R&D at ZEISS Semiconductor Manufacturing Technology
    Apr 2024 - Present · 2 yrs 3 mos

    Group Lead for Reactive Etching Process Development

  • UMS - United Monolithic Semiconductors (Full-time · 14 yrs)
    • Bereichsleiter Product Quality & Engineering
      Aug 2022 - Mar 2024 · 1 yr 8 mos

      Management of the Department Product Quality & Engineering

    • Stellvertretender Produktionsleiter
      Jan 2017 - Jul 2022 · 5 yrs 7 mos

    • Abteilungsleiter Process Control & Integration
      Jun 2015 - Jul 2022 · 7 yrs 2 mos

      Disziplinarische und fachliche Leitung der Abteilung Prozesskontrolle & Integration

  • Wissenschaftlicher Mitarbeiter at Ulm University
    Jan 2007 - Mar 2010 · 3 yrs 3 mos

    Simulation, Analysis and Optimization of AlGaN/GaN High Electron Mobility Transistors for Microwave Applications