Berlin, Berlin, Germany
research and development responsibility for inner layer bonding, surface preparation and adhesion promotion - non-etching adhesion promoter that promotes reliable mechanical adhesion for IC-Substrate and high frequency materials - new and innovative adhesion promoter that enables wet chemical metal deposition on glass with high aspect ratio through-vias - direct plating on molding resin enabling applications for conformal electromagnetic interference (EMI) shielding and “direct circuit formation” on molding resins, such as for FO WLP (FO PoP, FO SiP) - laboratory & cost center manager