Michael Kohlmann

Vice President Of Technology at Qualcomm

San Francisco, California, United States

About

Experience

  • Qualcomm (21 yrs 7 mos)
    • Vice President Of Technology
      Nov 2020 - Present · 5 yrs 9 mos

      Leading RF systems for Wireless Connectivity (WiFi, BT, GPS, UWB, FM, ...). Overseeing RF IC design for connectivity front-end modules

    • Sr. Dir, Engineering RF Systems
      2005 - Oct 2020 · 15 yrs 10 mos

      RF systems and RF HW / platform lead for connectivity products and solutions (WLAN, GPS, NFC, etc).

  • Staff Systems Engineer at Berkana Wireless
    Apr 2005 - Dec 2005 · 9 mos

    RF systems lead for W-CDMA CMOS RF transceiver development • Specification of Transceiver • Design and implementation of 3GPP system-level simulator including modeling of RF impairments and BB processing with HARQ Protocol • Track 3GPP standards development

  • Systems Engineer at Infineon Technologies
    2003 - Mar 2005 · 2 yrs 3 mos

    Design and verification of UMTS coprocessor for 3G handset platform

  • Member Tech Staff at Morphics Technology
    Jan 2000 - 2002 · 2 yrs 1 mo

    Design and verification of 2 generations of base-band processors for wideband CDMA (3G) base-station - Implementation of link level simulator for performance study and design verification in C++ - Development of various receiver algorithms (synchronization, adaptive channel estimation, etc) - Design and implementation of radio channel model providing required statistical properties - Customer support for 1st generation base-band processor

  • Systems Engineer at Philips Semiconductors
    1998 - 2000 · 2 yrs

    Design of base-band chip for third generation (UMTS) mobile terminals - Algorithm development for various receiver aspects - Definition of architecture, including hardware/software partitioning - Development of C++ reference fixed-point code - Coordination of hardware implementation (VHDL) 3GPP standard development - Representative of Philips Semiconductors in TSG RAN working groups 1 (physical layer) and 4 (radio aspects) - Collaboration with Philips Research