Michael Dittrich

IC Package Design Engineer at Racyics

Greater Dresden Area

About

• IC package co-design to ensure a seamless integration of the IC in State-of-the-Art packages • consider package design topics right from the initial stages of chip development. • Experience in all phases of electronic hardware development with special focus on fine pitch substrates for IC packages. • Design, layout and optimization of flip-chip packages and System-In-Package. • Power integrity and signal integrity (co-)simulation, including 3D-em-simulation of the package. • Coordination of prototype production. • Initial operation of hardware prototypes and creation of reference designs. EDA tools: Cadence Allegro, Mentor Xpedetion, Zuken CR-8000, CST Studio Suite, SiWave, Altium Designer, ADS, HSpice, Python, Matlab

Experience

  • Senior Staff IC Packaging Engineer at Racyics
    Feb 2020 - Present · 6 yrs 6 mos

    • IC package co-design to ensure a seamless integration of the IC in State-of-the-Art packages • consider package design topics right from the initial stages of chip development. • Design, layout and optimization of flip-chip packages and System-In-Package. • Power integrity and signal integrity (co-)simulation, including 3D-em-simulation of the package. • Coordination of prototype production.

  • Researcher at Fraunhofer IIS
    Jan 2012 - Jan 2020 · 8 yrs 1 mo

    Research on advanced IC packaging technologies. • Design and layout of System-In-Packages and Submodules w/ high-IO-count-flip-chip-ICs, multiple low-power memories and PMICs. • Design, layout and initial operation of a circuit board w/ multiple very high speed ADCs/DACs & FPGA w/ high speed Serdes. VHDL design for FPGA driving the ADCs/DACs. • Design, layout and initial operation of a circuit board w/ 60 GHz transmitter/receiver ICs. • VHDL design for 28nm IC (digital-part) including multiple high speed Serdes IPs. • Research on high speed silicon interposer interconnections for HBM and chip-to-chip interconnections. • Development of ADK (Assembly-Design-Kit) to enable an efficient design flow for advanced IC packages.

  • Design Engineer Systems at SeeReal Technologies GmbH
    Jul 2010 - Dec 2011 · 1 yr 6 mos

    Development of hard- & sofware components for a novel holographic display prototype. • VHDL design to further improve the algorithms of the holographic display • design and initial operation of circuit boards to test new subcomponents

  • Working Student at Fraunhofer Institute for Integrated Circuits IIS, Design Automation Division EAS
    Feb 2009 - Jul 2009 · 6 mos

    Development of VerliogAMS parser in Java/AntLR.

  • Working Student at ZMDI- Zentrum Mikroelektronik Dresden AG
    May 2008 - Oct 2008 · 6 mos

    Reserch on automatic translation of simulation results into a failure test programm for integrated circuits.