Michael Chen

Sr. Principal Design Engineer at Raytheon Intelligence & Space

Bedford, New Hampshire, United States

About

Over 20 years of experience in Analog and Mixed-Signal Integrated Circuit Design. Current experience with 0.18um CMOS and BiCMOS ADCs, DACs, low-noise front-ends, design for test, wide temperature operation, full-chip mixed-signal modeling and simulation. Multidisciplinary experience with ESD, EMC, package stress, thermal gradients, and automotive functional safety (ISO26262). Past experience in PLLs, GHz speed CML/ECL, SiGe, GaAs and InP HBTs. Over 30 years of experience in Electrical Engineering, including design of microprocessor controlled transducer circuits for military applications. Goal: to continue developing my career in integrated circuit design, working in roles commensurate with my experience and with opportunities for new ones. Specialties: Design of ADCs, DACs, mixed signal modeling, and full-chip simulation for integrated magnetic sensor chips.

Experience

  • Sr. Principal Design Engineer at Raytheon Intelligence & Space
    Aug 2022 - Present · 4 yrs

  • Principal Design Engineer at Allegro Microsystems
    May 2008 - Aug 2022 · 14 yrs 4 mos

  • Principal Design Engineer at Primarion
    May 2000 - Jun 2008 · 8 yrs 2 mos

    Company is now part of Infineon. Mixed-signal analog IC designer.

  • Member of Technical Staff II at TRW Defense & Space Systems Group
    Sep 1995 - May 2000 · 4 yrs 9 mos

    Company is now part of Northrop-Grumman. Integrated circuit designer. Worked in GaAs and InP HBT technologies.

  • Electrical Engineer at Westinghouse Electric, Electronic Systems Group
    Aug 1988 - Aug 1992 · 4 yrs 1 mo

    Company is now part of Northrop-Grumman. Design of microprocessor controlled transducer signal processing circuits for military systems.