Michael Behr

Senior R&D Leader at Dow

Midland, Michigan, United States

About

I lead the global Materials Science group in Dow's Core R&D division. This team is composed of experimental and computational materials scientists focused on delivering fundamental insights to drive the development of new and differentiated materials across multiple markets. I also have responsibility for driving our digitalization strategy across the organization. I have expertise in inorganic and polymeric advanced materials across a wide range of technologies, including novel silicone-polyolefin hybrid materials, carbon fiber for light-weighting applications, carbon nanomaterials, thin film CIGS photovoltaics, lithium-ion batteries, polyurethanes, silicones, and food packaging adhesives. Expert in design of experiments (DoE) methodology and statistical modeling. Six sigma black belt certified. I have over 15 years experience in advanced materials and interface characterization in both academic and industrial settings. Expert in advanced electron microscopy and associated spectroscopies (XEDS, EELS), synchrotron x-ray scattering and diffraction.

Experience

  • Dow (16 yrs)
    • Senior R&D Leader
      Jan 2020 - Present · 6 yrs 6 mos

    • R&D Group Leader
      Apr 2018 - Jan 2020 · 1 yr 10 mos

    • Research Scientist
      Apr 2017 - Jan 2020 · 2 yrs 10 mos

  • Graduate Research Assistant at University of Minnesota
    Sep 2004 - Jun 2010 · 5 yrs 10 mos

    Thesis Title:"Atomic hydrogen etching and growth of carbon nanotube films by plasma-enhanced chemical vapor deposition" Research focused on the fundamental understanding of the role of atomic hydrogen and catalyst during carbon nanotube etching and synthesis of carbon nanotube films by catalytic PECVD. Designed and set up PECVD reactor to grow nanostructured carbon materials, equipped with in situ Fourier-transform infrared spectrometer (FTIR), rotating-analyzer spectroscopic ellipsometer (SE), and optical-emission spectroscopy (OES). Studied growth of carbon nanotube films by PECVD using bright- and dark-field high-resolution transmission electron microscopy (HRTEM), selected-area and convergent-beam electron diffraction techniques (SAED, CBED), energy-dispersive x-ray spectroscopy (EDX), and electron-energy loss spectroscopy (EELS).

  • Engineering Intern at Honeywell Aerospace
    Jan 2002 - Jan 2004 · 2 yrs 1 mo

    Chemical-mechanical polishing (CMP) process development for metallic and dielectric thin films used in integrated circuit manufacturing.