Southington, Connecticut, United States
Lead Focused Ion Beam (FIB) / Scanning Electron Microscopy (SEM) technician supporting Development Engineering and Manufacturing to provide in depth, root cause physical failure analysis for new technology and its implementation into volume production for semiconductor and packaging products. Proficient on FEI Ga & Tescan Xe Dual Beam FIB's
Failure Analysis of Semiconductor and Packaging Devices using Focused Ion Beam (FIB) and Scanning Electron Microscopes (SEM) as well as Elemental Analysis through Energy Dispersive X-Ray Spectroscopy (EDS.)