Eindhoven, North Brabant, Netherlands
Experienced engineer with a demonstrated history of working in the semiconductor industry. Strong analytical and problem solving skills. Team player who initiates cooperation with partners to tackle technical challenges. Engineering professional skilled in Thin Films, Materials Science, FEA, Failure Mode and Effects Analysis (FMEA), Reliability Engineering, Black Belt and Lean Six Sigma methodologies.
Reliability engineering in the Quality & Robust Design group.
Responsible for early identification and evaluation of reliability risks of RF Frontend products. Developing qualification methodologies for RF modules. Coordination of qualification across different product lines.
Reponsible for qualification of sub-components (IC designs) and final product/module. Definition and execution of reliability qualification program together with multi-national suppliers, strategic partners and customers. Reponsible for failure analysis and customer claims handling (RMA). Experience with 8D, FMEA, DOE.
Responsible for reliability qualification and failure mechanism investigation of several MEMS devices. MEMS processing and packaging related dvelopments. Development of hardware and software for the qualification program. Initiation of collaboration with university and research institutes.
Consultant for several Philips product divisions on the area of thermal and mechanical reliability. Development of simulation methodologies (DfR) mainly focussing on semiconductor applications. Project management.