Brussels Metropolitan Area
Transforming automotive SoC platforms starts with transforming how we think about silicon. Why do I find product marketing in automotive chiplet systems so compelling? Because it’s about more than chiplets—it’s about how these building blocks enable a new class of products powering the next generation of safe, secure, high-performance vehicles. I don’t design silicon anymore—that’s the architects’ job. My role is to ensure that this aggregation of chiplets results in a platform that works in the real world, where functional safety and cybersecurity are essential, not optional. At IMEC, I manage the architecture track for next-generation chiplet-based automotive SoC platforms, built around an open ecosystem targeting ADAS, IVI, and body domain applications. My background in semiconductor design, ISO 26262, and ISO 21434 enables me to bridge technical teams, Tier 1s, and OEMs—translating architectural complexity into product value that resonates. Product marketing, for me, is about telling the system-level story: how chiplets achieve functionality, interoperability, and fail-operational behavior; how security is embedded from interconnect to application layer; and how performance is delivered through engineering discipline. The excitement lies in turning safety and security challenges into differentiators. Because in automotive, performance alone doesn’t win—confidence does. I bring a systems thinker’s mindset and a safety engineer’s rigor. I see where the risks lie, where opportunities emerge, and how to communicate the strategic value of this paradigm shift in automotive electronics. Let’s connect if you’re shaping the future of automotive SoC platforms. I’m always open to partnerships that combine innovation with collaboration.
• Part of the ACP team in the IMEC AUTO sector. • Act as project manager to coordinate activities between ACP and industry partners. • Lead the functional safety working group, taking on the challenge of applying functional safety to a chiplet-based system-in-package in advanced packaging using advanced node technologies. • Supervise the testability working group, taking on the challenge of making testing interoperable at the chiplets and system level.
• Part of the Automotive Sensors Division (ASD) which is currently the market leader for automotive CMOS image sensors (CIS). • Delivered the 5-megapixel (MP) sensor marketing requirements for ADAS and In-cabin applications (market research, product definition). • Product marketer of one of the highest revenue-generating CIS products through dual fab / dual sourcing supply management (P&L owner). • Led marketing cybersecurity (CS) and Functional Safety (FS) activities (requirements definition, products roadmap) with lead customers and ecosystem partners for next-generation CIS products (strategic “must-have” market enablers).
• Reshuffled IC development processes to minimize ISO 26262 impact on development time (time-to-market improvement). • Automated HW metrics extraction during product development to reduce designers' routines and boost motivation (turnover reduction). • Gathered business intelligence to find product gaps requiring Functional Safety enhanced architecture as a product differentiator to gain market shares (increase operating revenue).
• Initiated 27 Functional Safety based proposals for product lifecycle improvement (time-to-market reduction, reliability monitoring). • Conducted Business & Market analysis to differentiate products on the market based on Functional Safety features to boost sales. • Heavy contributor to NXP Long-Term Initiatives with focus on elaboration of business concept / business model for Safety by proposing advanced Safety Mechanisms based on Machine Learning. • NXP BE-INN Innovation committee ambassador focused on finding business opportunities based on new NXP ideas.
• Elaboration of Marketing strategy to introduce new Global Foundries 22nm FDX SOI technology on the Chinese IoT market (sponsored by Global Foundries). • Set Corporate Strategy analysis/recommendations for ON Semiconductors BU Automotive (SWOT, Porter) to cope with IC market commoditization, engineering resources scarcity, shrinking development times.
• Among the first members of the BU automotive functional safety strategic team. • Key contributor to the company ISO 26262 supporting material (training, work products, assessments) as market “must have”. • Established ISO 26262 product development method to speed up development and reduce designers' workload (cost optimization).
• Technical Manager (10 designers - analog / digital) including customer support for System and ASIC specifications. • Full project management (risk, budget, resources, planning, results validation, customer interface, audit compliance, team leading). • Assisted Sales and Marketing for commercial offers.
• Digital ASIC architect for technical feasibility with Sales & Marketing during ASIC RFQs to win design programs with customers. • Led the “design reuse” strategy for digital development to optimize engineering costs & reduce development time. • Drove three strategic initiatives for the BU Digital Design team to reduce development time (time-to-market) and increase competitiveness.