Milan, Lombardy, Italy
Long experience on semiconductor assembly process and back-end operations. Leadframe and BGA design for power and signal packages (NOR / NAND Flash memories / MEMS / ASIC). Team working & project management across different worldwide geographic areas. Very good computer skills.
Analog & MEMS package documentation management for Consumer, Automotive, Industrial and Medical products. Coordinator between IC design and production area (Internal plants / Subcontractors). Technical data management.
Analog, MEMS and Sensor Product Group. MEMS Technology & Package Development. Study & Development of new packages for MEMS Consumer, Automotive, Industrial and Medical applications. Coordination between the IC Eng. and the production area (Internal plants / Subcontractors). Responsibility from first prototype to mass production. Technical competitors analysis. Management of technical documentation.
Coordination between devices project leaders and assembly production plants. Engineering and development activities for the assembly of digital memories NOR / NAND across worldwide geographic areas. Competirors techinical analysis. Subcontractors engagement and management.
Engineering and development activities for the assembly of digital memories NOR / NAND across worldwide geographic areas. Interface between devices project engineers and assembly lines internal and external (Subcontractors). Materials & process validation.
CAD drawings (2D, 3D) of complex parts for the assembly of the integrated power & signal devices. Creation & management of technical documentation archives in electronic format. IT support and programming development for the assembly depatment (Data collection, workflow etc...). Assemblly manufacuturing & maintenance.
Participation to police operation called "Sicilian Vespers" (minute 1:03).