Boise, Idaho, United States
30+ years of Semiconductor industry experience: DRAM, NAND, Embedded, Advanced Packaging. Deep knowledge in Technology Development (Process Integration, Process and Equipment Development, transfer and manufacturing). Experience in DRAM Design and Product Engineering. 25+ years of leadership experience. Lived and worked at different cultures (Germany, France, Japan and USA).
DRAM Design and Product Engineering for new technology nodes.
Technology Team Leader for semiconductor technologies
Technology team leader advanced semiconductor technology development
Technology team leader advanced semiconductor technology development
Sub-project leader semiconductor manufacturing and development.