Royal Sutton Coldfield, England, United Kingdom
I am currently based in Birmingham and holding a BN(O) Visa which grants me the right to work in the UK without the need for visa sponsorship. I spent five years at Cloud Light Technology Limited / Lumentum (Lumentum completed the acquisition of Cloud Light in July 2023), where I held the following roles: • 2.5 years as a Senior Electronics Engineer in Hong Kong • 2.5 years as an Electronics Consultant (internally equivalent to a Principal Engineer) in the UK Cloud Light / Lumentum is a leading supplier of optical transceiver modules to Tier-1 clients. I was privileged to contribute to HFSS simulation, circuit simulation/design and PCB layout for the 1.6T PSM8, 800G PSM8, and 400G PSM4 optical transceiver projects. These efforts required close collaboration with photonic IC, mechanical, firmware, and optical teams—covering the entire lifecycle from concept to mass production. Notably, the 800G PSM8 and 400G PSM4 modules passed all reliability tests and are now in full-scale production. Summary of Key Projects and Product Experience Over the course of my career: • 1.6T PSM8 Optical Transceivers (Prototype) • 800G PSM8 Optical Transceivers (Mass Production) • 400G PSM4 Optical Transceivers (Mass Production) • Fibreless Optical Transceivers (Feasibility Study & Circuit Design) • FMCW LiDAR System (PCB Design) • U8089 – High-Precision Depth Camera (Demo) • UCL360 – 3D AI Scanner for Building Measurement (Demo) • L360 – High-Resolution Single-Line LiDAR (Design Phase) • Robot Vacuum Cleaner (Feasibility Study, Patent Granted) • 2.5D & 3D Cover Glass Inspection Systems (Demo) • Mobile Lens Inspection System (Demo, Patent Granted) • Optical Core Inspection System (Deployed in Client Factories) • Power Mosfet process control (Mass Production) • SAR ADC & 555 Timer IC Design (University Projects)
Cloud Light / Lumentum is a well-known supplier of optical transceiver modules to Tier-1 clients. I was fortunate to be deeply involved in HFSS simultion, electronic circuit design and PCB layout for several key projects, including the 1.6T PSM8, 800G PSM8, and 400G PSM4 modules. These projects required close collaboration with teams specializing in photonic IC, optics, mechanics, and firmware, and progressed from initial concept to full mass production. Notably, both the 800G PSM8 and 400G PSM4 modules passed all reliability tests and are now in volume production. In addition to these projects, I contributed to the development of an FMCW LiDAR system and the feasibility study of a fibreless optical transceiver module—both of which expanded my technical knowledge. I also served as a mentor to junior engineers, guiding them in circuit design and layout. I believe my high-speed PCB design expertise and wide-ranging technical knowledge will be valuable assets to your engineering team. Main product: 1. 1.6T PSM8 SiPHo Optical transceivers (Prototype) 2. 800G PSM8 SiPHo Optical transceivers (Mass Production) 3. 400G PSM4 SiPHo Optical transceivers (Mass Production) 4. Wireless Optical Transceivers (Feasibility Study & Circuit Design) Job Duty: - Cooperate with optical engineer, mechanical engineer and software engineer to complete the products. - Support our foundry member to turn sample into mass production - Responsible for RF simulation with HFSS and PI simulation with SI wave. - Responsible for circuit design and layout using HDI, substrate / mSAP fabrication process. - Inspiring new ideas for patent application - Inspiring new ideas for IC selection, circuit design and circuit layout. - Gilding Junior Engineer for circuit design, measurement and product concept. - Enhance our teammate working efficiency by standardizing BOM, pick & place file generation. - Feasibility study of any new conceptual idea.
Main product: 1. 800G PSM8 SiPHo Optical transceivers (Mass Production) 2. 400G PSM4 SiPHo Optical transceivers (Mass Production) 3. FMCW Lidar system Job Duty: - Cooperate with optical engineer, mechanical engineer and software engineer to complete the products. - Support our foundry member to turn sample into mass production - Responsible for RF simulation with HFSS and PI simulation with SI wave. - Responsible for circuit design and layout using HDI, substrate / mSAP fabrication process. - Inspiring new ideas for patent application - Inspiring new ideas for IC selection, circuit design and circuit layout. - Gilding Junior Engineer for circuit design, measurement and product concept. - Enhance our teammate working efficiency by standardizing BOM, pick & place file generation. - Circuit measurement and verification Award: - Best Team Performance award in 2021 - Talent Retention Incentive Program in 2022
Main product: 1. U8089 – High precision depth camera (Demo) 2. UCL360 – 3D AI scanner for building measurement (Demo) 3. L360 – High resolution single line Lidar (Design phase) Job Duty: - Responsible for managing and designing the cooperated project with ASTRI (U8089 & L360). - Application for Enterprise Support Scheme by ITF - Inspiring new ideas for patent application (A Special TOF module for VSLAM) - Responsible for whole electronic design, PCB layout and firmware of UCL360 - Responsible for whole system design of L360 including conceptual, electronic design & layout and programming.
Main product: 1. 2.5D cover glass defect inspection machine (Demo) 2. 3D cover glass defect inspection machine (Demo) 3. Mobile phone lens defect inspection machine (Demo) 4. Optical isolator defects inspection machine (Deployed in Client Factories) Job Duty: - Cooperate with optical engineer, mechanical engineer and software engineer to construct different types of the defect inspection machine. - Responsible for whole electrical design of different machine which include motion and sensor control, image capturing, pattern generation and safety precaution. Industrial grade PLC and PCI/PCIe control card were selected to finish all the automation. - Travel to different customer for machine assembling and tutoring. - Guiding junior engineer to make sure that they can complete the task on time