Seoul, South Korea
Strategic Technical Advisor | Ph.D. in Electrical Engineering | 15+ Years of Semiconductor R&D Leadership I am a seasoned semiconductor expert with over 15 years of experience at a leading global semiconductor company, specializing in the end-to-end lifecycle of advanced logic nodes (Sub-5nm FinFET/GAA) and high-performance packaging solutions. My career has been dedicated to bridging the gap between cutting-edge research and high-volume manufacturing (HVM) excellence. ■ Core Expertise: - Advanced logic process development: Extensive track record in driving the transition from FinFET to next-generation GAA (Gate-All-Around) architectures for sub-5nm nodes. I specialize in solving complex structural and material challenges to stabilize early-stage yields and device performance. - Packaging & HBM yield optimization: Strategic insight into the integration of 2.5D/3D packaging structures and High-Bandwidth Memory (HBM). I focus on addressing technical bottlenecks in TSV and micro-bump integration to secure the performance of AI-driven semiconductor products. - Smart Inspection & Metrology: Expert-level understanding of Automated Optical Inspection (AOI) and vision solutions. I provide unique perspectives on selecting and optimizing inspection toolsets to maximize yield in both front-end and back-end processes. Throughout my tenure, I have balanced deep technical execution with strategic advisory, aligning engineering roadmaps with market demands. I am passionate about the evolving semiconductor ecosystem and the transformative potential of advanced nodes and heterogeneous integration. ■ I am currently open to: - Expert network consultations (GLG, Guidepoint, etc.) - Technical advisory and strategic consulting projects - Academic and patent-related technical documentation/translation If you are looking for a technical partner who can provide grounded, practical insights into the future of semiconductor manufacturing and yield management, feel free to connect or reach out.