Jun-Rong Tseng (曾俊榕)

Theil TE department senior software engineer

Hsinchu City, Taiwan, Taiwan

About

2022.6~ Developing automated data analysis programs to shorten 30% of the staff's working time and ensuring the accuracy of analysis results for manager team to make the decision or policy. Strengthening the company's quality management and improving customer satisfaction (real-time monitoring system for production line operation). 2021.5~2022.6 In charge of development of CIS inspection machine(C340HX), including the algorithm to recognize defects from different Package layers( glass top/bottom, die), die-bonding/wire-bonding defect, substrate/BGA/Epoxy/glue/compound defect, package side inspection and illumination method. Cooperating with KOR R&D, designed team and end user. To solve end user application issues with Intekplus machines. To collect end user feedback to further improve Intekplus machine software and mechanism. 2013.2~2021.5 8 years experience doing AOI software development in CIS package for automative industry, using visual studio C/C#/C++, dothinkey, devwareX, simian, Hyvision SDK. Recently I have completed two AOI projects. One is FVI(HT-1603), flying test designed, multiple-angles light source, achieve 3um/pixel in resolution.The other is PLAI(HT1610), auto focusing, 2D Reader, real-time particle monitor, inking tools.

Experience

  • Deputy manager at TONG HSING ELECTRONIC Zhubei
    Jun 2022 - Present · 4 yrs 1 mo

    CIS Imaging test development, Automated system development and Data Analysis, dashboard, DB, AOI technology consultant, semi auto AOI platform dev, AOI to micro scope defects coordination switching. Halcon 13/18, Cognex AI, Onsemi Devware, YoLo, ARM Cortex-M

  • Application Engineer at INTEKPLUS Co Ltd
    May 2021 - Jun 2022 · 1 yr 2 mos

    As the role of Intekplus team Taiwan branch, maintain the machine and participate in CIS AOI machine development.

  • Software Development Engineer In Test at Kingpak
    Feb 2013 - May 2021 · 8 yrs 4 mos

    2018-2021 Developing FVI and PLAI AOI software to detect sensor and non sensor area defect, including particle, scratch, contamination, die chipping/crack, back side substrate inking, OCR, ball, especially to recognize which layer the defect belongs to (glass top, bottom or die layer). Familiar with lighting technics, optical system selection. 2013-2017 Developing software, Windows, to detect image dead、wounded、hot pixel、cluster、blemish、dead-line、white balance、 dark corner、uniformity、color ratio phenomenon at yuv、low、middle、dark mode. chroma DC program maintain.