Sunnyvale, California, United States
Program Manager with 7+ years of experience leading cross-functional product development in consumer electronics and enterprise hardware. Proven success in 0-to-1 product innovation, NPI execution, and supply chain collaboration. PMP-certified, data-driven, and skilled at bridging design, engineering, and operations to deliver scalable solutions from concept to mass production
PCBA Build Management & Material Readiness for Post-Silicon Validation
• Successfully launched 4+ servers NPI projects with a combined budget in the multi-millions, consistently delivering on time and within budget • Led collaboration with US Headquarters and global teams, optimizing product development enhancing design quality and ensure seamless integration across multiple platforms from NPI to production, resulting in a 25% reduction in project development costs • Directed cross-functional teams in conducting comprehensive PCBA cost analysis and enhance material readiness across generations and platforms, from NPI to production.
• Managed development of 6+ products with precise BOM management using SAP S/4HANA • Efficiently allocated PTM(platform test matrix) devices and IUR(Internal unit request), achieving a 20% budget reduction
• Conducted extensive market research to identify educational trends and needs for product development • Dynamically defined and revised the product roadmap, created user stories, and prioritized feature launches to align with market demands and customer needs, while also conducting product training for regional sales teams • Collaborated and managed with 3+ contract manufacturers(CMs)for software, hardware solutions and manufacture
• Initiated the data collection process in collaboration with PM and engineering teams across 3 product lines • Developed data visualizations and reports using BigQuery, Data Studio, and Tableau to communicate insights to stakeholders, collecting, validating, and analyzing over 300+ user behavior events to offer data-driven strategies for product enhancements and optimizations
Responsible for consumer electronics product ,Intel NUC(mini PC) & Compute card Project: •Managed end-to-end new product development schedules with cross-functional teams, vendors, and customers, overseeing build plans, materials preparation, and engineering issue tracking to ensure timely product launch •Provided onsite support during NPI stage builds in Shenzhen factory, conducting troubleshooting for production issues, and generated weekly reports to track project issues with customers •Defined product BOM structure and conducted cost analysis to ensure development costs remained within budget •Managed EOL, ECR, and ECN processes, maintaining material and product development documentation in ERP, MRP, and PLM systems
Dedicated for Broadcom Project: • Developed new saw technology for printed circuit boards, enhancing manufacturing efficiency • Successfully executed NPI ramp-up for over 4+ products in the factory, ensuring quality compliance and timely project delivery by coordinating with sales, factory, and customers, while providing critical technical support, defect analysis, and clear communication through technical roadmaps and project updates