Zurich, Zurich, Switzerland
Engineering leader with experience scaling multidisciplinary hardware and robotics teams, driving industrialization, and delivering complex automated systems from concept to production. I’ve led organizations through rapid growth, managed large‑scale equipment programs, and worked across mixed FTE and contractor structures in fast‑moving, high‑reliability environments. My background spans robotics, industrialization, manufacturing processes, and technical program leadership, supported by a First Class Honours master’s degree from the University of Edinburgh.
Wingtra is developing unmanned aerial vehicles used by professionals in surveying, mapping, construction and mining. The platform consists of a fixed-wing VTOL drone, equipped with various sensors (IMU, radar, TOF) and payloads (RGB, LIDAR, multispectral camera, parachute). My team and I are responsible to deliver reliable, high-quality products, from prototyping to series production. Responsibilities & Focus Areas: • Lead Industrialization and Quality activities for high‑reliability UAV hardware, including test development, production readiness, and continuous testing • Drive DFx efforts (manufacturability, testability, assembly, reliability) to transition designs into scalable, high‑volume manufacturing • Define and implement industrialization processes across hardware, electronics, and system‑level assemblies • Collaborate with R&D, Supply Chain, and Manufacturing partners to ensure robust product readiness and smooth production ramp‑up • Develop qualification & test strategies, production tooling, and quality controls to ensure consistent production yield and product reliability in the field
Responsibilities & Achievements: • Developed in‑line and off‑line testing and measurement solutions for battery module and pack manufacturing, supporting the transition from prototyping to mass production • Evaluated components, instruments, and sensors for electrical, mechanical, and vision‑based test systems • Designed semi‑automated prototype test stations and fully automated production test equipment • Defined manufacturing test requirements in collaboration with Design, Process, and Quality teams • Delivered systems across multiple test disciplines, including: – Electrical tests: ACIR, DCIR, OCV, weld micro‑resistance, BMS, dielectric withstand, insulation resistance, charge/discharge – Mechanical gauging, geometric inspections, and metrology – Machine‑vision inspection and guidance – Leakage testing
Responsibilities & Achievements: • Led the Equipment team delivering automated production lines for a new battery module and pack manufacturing facility • Managed full equipment lifecycle: specification, design, vendor selection, commissioning, ramp‑up, and handover • Developed prototype equipment, processes, and built up the pilot site in Stockholm prior to industrialization • Delivered multiple high‑value automated systems into a greenfield site in Poland under tight timelines • Acted as Automation Manager during the scale‑up phase: recruited the automation team, defined automation strategy, and hired the permanent manager • Worked across automation, robotics, PLCs, dispensing, laser welding, and factory logistics to bring the line into successful operation
Key achievements: • First site to implement high-speed in-line 3D AOI-AXI inspection system in 2018 • First site to implement selective soldering in 2019 • First site to implement solder jet printing in 2020 • First site to implement in-line 8-probe double-sided flying probe tester in 2020 • Generated >$3M additional revenue from re-sourcing projects in 2020 Activities: • High mix assembly and test of high reliability (IPC Class 3+) printed circuit board assemblies used in high temperature, shock and vibration environment. • Project manager in charge of modernization of assembly line ($2.5M CAPEX over 2 yrs). Budget justification, supplier and equipment selection, negotiation, evaluation, qualification and implementation of systems including: - Selective soldering - De-fluxing - Pick and place SMT - Automated dry SMT component storage towers - Xray SMT component inspection and counting - High speed solder paste and adhesive jetting - 8-probe double-sided flying probe tester - Automated conformal coating, potting, underfill
• Assembly and testing of high reliability (IPC Class 3+) printed circuit board assemblies used in high temperature, shock and vibration environment • Project manager for modernization of assembly and testing systems ($1M over 3 yrs). Budget justification, selection, evaluation, qualification and implementation of systems including: - Functional test equipment based on customized National Instruments platform - Automated optical and x-ray inspection equipment - Hot air and infrared component rework stations - Manufacturing Execution System software including sub-modules for: stencil design, flying probe test programming, material & process traceability, and creating work instructions - Humidity control systems
• Electronics test engineer in charge of developing in-process and functional tests for printed circuit board assemblies • Programming 4-probe flying probe tester (FICT/FPT) • Programming automated optical inspection (AOI) • Develop functional tests on customized National Instruments platforms (LabView, TestStand) and Schlumberger ATE platforms (GPIB, VXI, PXI, USB hardware programmed in Visual Basic, C, C++). • Team lead of 2 test technicians
• Develop reference code and MAC-layer QoS scheduling algorithms for mobility-enhanced WiMAX (IEEE 802.16e) base stations.