India
🔹Semiconductor Equipment Service Engineer | Wire Bonder & Wafer Dicer Specialist | OSAT Backend Manufacturing 🔹Experienced Service Engineer in the semiconductor OSAT (Outsourced Semiconductor Assembly & Test) industry, specializing in wire bonding and wafer dicing equipment. Skilled in installation, preventive maintenance (PM), corrective maintenance (CM), troubleshooting, and calibration of high-precision backend assembly machine 🔹I have completed training on wire bonding technologies at Kaijo Corporation in Japan (April 2024). This experience has deepened my expertise in semiconductor packaging, providing me with unique insights into the latest innovations and best practices in the industry. 🔹 Freelance Experience: Collaborated with 15+ clients across 5+ countries through Fiverr. Delivered 20+ projects involving: Data Scraping, Pre-processing, and Analysis Visualization and Dashboard Building Machine Learning, Model Evaluation, and Deployment Driving Insights and Generating BI Reports
Maintain and support dicing equipment in a high-volume semiconductor production environment • Diagnose and resolve mechanical, electrical, and process-related issues to reduce downtime • Perform preventive maintenance and calibration to ensure consistent machine performance • Provide support for wire bonding processes and assist in troubleshooting • Collaborate with cross-functional teams to improve yield, throughput, and process stability • Analyze recurring issues and implement corrective actions for long-term reliability