Taoyuan City, Taoyuan City, Taiwan
To lead Module Development team (12 R&D engineers) Co-work and coordinate with production line. New project risk assessment and design recommendation to customer. Developed new package structure and technology for VCSEL 3D sensing, Saw filter, advanced CIS,Ku and Ka band communication and thermoelectric separation package…etc.
1. Reviewing customer's package request and then provide risk assessment, design recommendation and process/package proposal accordingly. 2. Package for PA, SIP, High-frequency radar, power switch(GaN&SiC),fingerprint module,optical communication, MEMs, saw filter and CMOS image senor...etc. 3. New technology development as BVA(Bond Via Array), precise 90 degree flip chip bond approach(Patent inventor), solder bumping, RDL, RF shielding, Glass on wafer...etc. 4. New package development as low profile package, Fan-out package, PoP, ceramic embedded QFN...etc.
- Establish DRAM product process flow and specifications. - Yield improvement and maintenance. - Defect and failure analysis
- Cooperate with customer to achieve novel structure NAND flash. - Establish run card process flow and its feasibility evaluation - Sample failure analysis and yield improvement