Lahore District, Punjab, Pakistan
I am a hardware design engineer specializing in AI compute systems, high-speed PCB design, embedded electronics, and system-level architecture. My work spans advanced OAM/UBB platforms, DC-MHS server boards, multi-rail power delivery networks, and complex BGA/ASIC-based designs exceeding 5,000 pins. I focus on building reliable, high-performance hardware for next-generation AI, IoT, and communication systems. Over the years, I’ve contributed to cutting-edge projects involving PCIe/SerDes, DDR memory, RF modules, camera systems, power modules, MCU/SoC development, and FPGA/ASIC hardware acceleration. My experience includes full product cycles—from architecture definition, schematic development, simulations, and PCB constraints to bring-up, debugging, and DVT execution. I also work closely with international engineering teams (US & Malaysia), providing remote support, technical reviews, waveform analysis, and system validation. Collaboration with vendors such as Intel, MPS, TI, Nordic, Quectel, and others is a core part of my workflow for component verification and reference design development. I’m passionate about solving complex engineering challenges, documenting design processes, and helping teams deliver robust, production-ready hardware. If your work involves AI hardware, system architecture, embedded platforms, or high-speed digital design, I’m always open to connecting and collaborating.
As a System Design Engineer at Global Engineering Services, I lead the design and development of complex electronic systems. My role encompasses: ➢Leading schematic, PCB design, and system integration for advanced AI hardware, IoT devices, and high-performance computing platforms. ➢Designing OAM-, UBB-, and DC-MHS-based boards, including power delivery networks, high-speed interfaces, multi-rail sequencing, and complex ASIC/BGA integrations (5000+ pins). ➢Driving full hardware development cycles: architecture definition, component selection, schematic creation, layout constraints, bring-up, and DVT execution. ➢Developing mixed-signal and high-density boards involving PCIe, SerDes, DDR, RF modules, power modules, sensors, MCUs, and custom ASIC interfaces. ➢Building subsystems such as BLE/Wi-Fi communication units, FPGA/ASIC-based accelerators, and embedded controller architectures (STM32, ESP32, TI MCUs, Nordic). ➢Providing technical support across regions (PK ↔ US/Malaysia), including remote debugging, failure analysis, documentation, and design review feedback. ➢Managing vendor engagement with Intel, AMD, TI, MPS, Nordic, Quectel, and others for component validation, reference designs, and issue resolution. ➢Preparing PRDs, design guides, PCB placement studies, case studies, marketing material, and customer-facing technical documents. ➢Supporting manufacturing readiness: test strategy, waveform/DVT data analysis, sequencing validation, and resolution of bring-up issues. ➢Conducting internal training for DVT analysis, high-speed design, power sequencing, and system-level architecture.
As an R&D and Testing Engineer at Electrical Engineering Services (EES), I played a key role in the research, development, and testing of educational training equipment, focusing on electronics, power electronics, and process control designs. My responsibilities included: ➢New Product Introduction: Led the introduction of new products, ensuring seamless integration into existing lines. ➢Performance Improvement: Diagnosed and resolved product performance issues to enhance quality and reliability. ➢Specification Development: Worked with the Lead Engineer and clients to develop detailed functional and design specifications. ➢Testing Procedures: Developed and implemented testing procedures for hardware and software components. ➢Client Support: Provided training and technical support during equipment commissioning and installation. ➢Quality Assurance: Maintained strict adherence to international standards throughout the product development process. During my tenure at EES, I contributed to the successful development of high-quality educational training equipment, ensuring compliance with international standards and client satisfaction.
As a Trainee Electrical Engineer at Bahria Town, I gained hands-on experience in electrical maintenance and operations. My key responsibilities included: ➢Cable Installation: Monitoring the end-to-end cable laying processes for Feeders, HT, and LT cables. ➢Cable Termination: Performing cable terminations in RMUs, Transformers, and Distribution Boards (DBs). ➢Fault Detection and Rectification: Using Hi-Pot testing for fault detection and rectification in cables. ➢Service Evaluation: Evaluating services for faults and quality, and implementing service restorations. ➢Team Communication: Maintaining effective communication with technical and non-technical teams. ➢Project Site Observations: Ensuring correct installation of electrical equipment at project sites. ➢Equipment Layouts: Reviewing equipment layouts, cable routing, and maintaining HT transformers, motors, DBs, HT switches, and HT ring main system units. This role provided me with valuable insights into practical electrical engineering, enhancing my skills in maintenance, operations, and team collaboration.
As a summer intern at IESCO, I gained practical experience in the operation and maintenance of grid stations. My key responsibilities included: ➢Grid Station Operation: Assisted in the daily operations and maintenance of grid stations. ➢Equipment Testing: Conducted detailed testing of grid equipment to ensure optimal performance. ➢Transformer and Relay Testing: Performed testing on transformers and relays to verify their functionality and safety. ➢Schematic and Diagram Creation: Created schematic drawings and single-line diagrams for grid station equipment. This internship provided me with valuable hands-on experience in electrical grid operations and maintenance, enhancing my technical skills and understanding of power distribution systems