Irvine, California, United States
I am a Signal and Power Integrity Technical & Project Lead driving the hardware architectures that power today's most advanced artificial intelligence. Armed with a Ph.D. in Electrical Engineering from Missouri S&T, I specialize in solving critical hardware bottlenecks at the silicon, package, and board levels. Currently focused on next-generation AI chips, I turn complex engineering challenges into highly optimized, high-performance solutions. My core expertise includes: * High-Speed SerDes * Power Delivery Networks (PDN) * Advanced Packaging * D2D & HBM Integration
High-Speed SerDes Power Delivery Networks (PDN) Advanced Packaging D2D & HBM Integration