San Diego, California, United States
With 10+ years of experience in RF/microwave circuit/package design, I am a Senior Staff Engineer at Qualcomm Technologies, Inc., the world's leading wireless technology innovator. I am passionate about advancing the state-of-the-art in wireless technology and delivering high-performance, reliable, and cost-effective solutions for Qualcomm's customers and partners. In my current role, I lead RF/mmWave module design and oversee the entire design cycle, from concept to validation. I use various tools and methods, such as Cadence SiP/APD/Allegro and ANSYS HFSS, to design, simulate, optimize, and test the RF modules for different applications and scenarios. I also collaborate with cross-functional teams, including IC design, antenna design, system engineering, and manufacturing, to ensure the quality and compatibility of the RF modules. Some of my recent achievements include designing and launching the world's first fully integrated 5G mmWave module for smartphones, and securing a large contract with a leading telecom operator for 5G infrastructure deployment.