Munich, Bavaria, Germany
Semiconductor Manufacturing Professional with 20 years experience in various Process, Process Integration, Technology Development, NPI roles with indirect and direct people management responsabilities. Experience in Memories, CMOS Image Sensors and Logic devices down to 28nm node. Since 2017 focusing on RF passive filters and MEMS in various Process Integration and NPI leadership roles. Extensive experience with Project Management, Problem Solving and Quality tools. IASSC Lean Six Sigma certified Black Belt.
Principal Manager, Operations
Responsible for Metrology and Process Integration/Yield in RF filters manufacturing
Process Integration and Yield Engineer for BAW RF filters manufacturing
Principal technology and integration engineer working on 32nm/28nm node Copper BEOL. Responsible for process development/improvement, involved in problem solving activities, defect reduction, yield improvement, quality deviant material dispositioning.
Since 2010 Process integration engineer in the Technology Development group working mainly on Copper Back-End-Of-Line integration. In addition responsibilities in the Backside Illumination CMOS Image sensors process integration mainly in new pixel modules development for optical performances improvement.
Metrology applications engineer supporting process areas in statistical process control and using data analysis methods to understand and address area issues. As metrology application engineer I have been responsible of developing and maintaining metrology applications in the following areas/technologies: 1. Film Thickness/Optical properties characterization (Spectrometers, Ellipsometers) 2. Surface Profiling, AFM 3. XRR/XRD 4. Sheet Resistance 5. FTIR 6. Surface Charge Analyzer I have been also responsible of supporting Technology Development group in providing novel metrology applications for 90nm node FEOL and BEOL modules