Gennaro Toscano

Quality Control Manager | Semiconductor & 3D Glass Microfabrication | Process Optimization & Yield Improvement | SPC • Data-Driven Manufacturing

Lugano Metropolitan Area

About

Process and Quality professional with 23 years of experience across Italy, the UK and Switzerland in the semiconductor, optical components and advanced microfabrication industries. Over the years I have developed deep expertise in device fabrication processes, process integration, equipment engineering, statistical process control (SPC), yield improvement and data-driven problem solving. My work combines strong analytical skills with hands-on knowledge of industrial manufacturing environments. I am currently Quality Control Manager at FEMTOprint, where I oversee quality processes and analytical activities related to 3D glass microfabrication, supporting advanced manufacturing and continuous process improvement. I hold Green Belt and Black Belt certifications (CISQ Automotive) and a degree in Electronic Engineering, with academic focus on Biomedical Engineering, Electronic Measurements and Applied Statistics (DOE, Gage R&R). My professional interests include advanced manufacturing technologies, microfabrication, process optimization and quality systems.

Experience

  • FEMTOprint SA (Agno, Ticino, Switzerland · On-site)
    • Quality Control Manager
      Nov 2024 - Present · 1 yr 9 mos

    • Process Engineer
      Apr 2024 - Oct 2024 · 7 mos

  • Axetris AG (Kägiswil)
    • Litho / Dry Etch Process Team Leader
      Apr 2023 - Apr 2024 · 1 yr 1 mo

    • Process Integration Engineer
      Nov 2022 - Mar 2023 · 5 mos

  • STMicroelectronics (Full-time · 3 yrs 9 mos)
    • Dry Etch Process Team Leader
      Oct 2021 - Nov 2022 · 1 yr 2 mos

      Dry Etch Process Team Leader at STMicroelectronics

    • Dry Etch Process Engineer
      Mar 2019 - Sep 2021 · 2 yrs 7 mos

      As a Dry Etch Process Engineer I was responsible for: • Dielectric Etching recipe optimization on LAM/TEL tools (LAM 2300 Flex/Flex45, LAM Exelan HPT, LAM 4520 XL, TEL DRM) • Equipment start-up/conversion and related process qualification with using of risk assessment and project tracking quality tools (e.g. FMEA, PCP) • Equipment performances optimization and cost reduction projects • Day by day issues management on both process and equipment side • SPC champion for leading Dry Etch Conductor/Dielectric team for improving equipment up-time and process variability reduction using statistical tools (SPC, JMP, FDC)

  • Principal Process Development Engineer at OCLARO
    Sep 2012 - Feb 2019 · 6 yrs 6 mos

    As a Principal Process Development Engineer in the Dry Etch and Metrology areas, I design and optimize plasma etch processes and direct the sustaining and monitoring efforts for metrology equipments performances. My primary areas of responsibility include plasma dry etch process characterization, optimization, design, troubleshooting, and fundamental research. I interact with groups such as device engineers, R&D, quality, manufacturing, and equipment vendors to ensure robust etch processes that meet the precise physical and electrical requirements for Oclaro products. I'm also the Project Leader of all SPC (Statistical Process Control) activities: - SPC tool creation, maintenance and optimization using R statistical computing and graphics language - Coordination of all process, device, quality and equipment engineers to maintain volume production by means of SPC, driving projects and/or troubleshooting in order to reduce process variability - Perform Design of experiments and Gage R&R to enable continuous improvement for robust baseline processes and metrology equipments - Setting up defect and performance qualification procedures

  • Shift Process Engineer at International Rectifier
    Apr 2011 - Sep 2012 · 1 yr 6 mos

    As a Shift Process Engineer, I was responsible for monitoring, sustaining, and improving both 6 and 8 inches IR fabs in Newport (UK). The work included cooperation and supervision of production operators and area technicians for silicon-based semiconductor products. In this position, I addressed tools in several process area (Dry Etch, Wet Etch, Photolithography, Diffusion, Implant, CVD/PVD) that were out of established SPC (Statistical Process Control) rules for both process and defect related issues or down for equipment issues and managed scrap, excursions and lots on hold.