Frans Voogt

Quality and Reliability engineer at NXP Semiconductors

Nijmegen, Gelderland, Netherlands

About

Materials scientist with strong analytical and communication skills. Starting out as chemistry student, I have gradually specialized myself in the surface and bulk properties of the solid state. Currently, I am working as a process and materials analyst in the semiconductor industry. I love investigating complex problems that require a broad view and multidisciplinary approach. My ambition is to provide customers with timely solutions while delivering innovative output of the highest quality. Involved in research projects as well as in production issues. I consider myself as a team player in the first place. On the other hand, I have proven to be a succesfull autonomous researcher as well. Friendly but determined. No-nonsense attitude; wants to get the job done. Specialties: - Silicon (substrates / wafers, thin films, crystal defects, etching) - IC process technology, especially front-end issues. Also interested in solar cell technology - Thin film deposition (epitaxy, CVD, ALD) - Crystal growth - Surface and bulk analysis techniques. Hands-on experience with numerous methods, including SEM, TEM, EDX, EELS, FIB, SIMS, XRD, XPS, AES, RBS, AFM, µ-PCD, SIRD and wet-chemical etching - Coaching. I enjoy teaching process courses or giving tool training to colleagues PMI-certified Project Management Professional (PMP) ITC-certified Infrared Thermographer Level 2

Experience

  • NXP Semiconductors (25 yrs 8 mos)
    • NPI quality engineer PL Personal Health
      Jan 2017 - Present · 9 yrs 6 mos

    • NPI quality engineer PL Wearables & Fitness
      Nov 2015 - Jan 2017 · 1 yr 3 mos

      Operating in a truly global, virtual project team with product design and engineering in Beijing, manufacturing in Suzhou and Kaohsiung, testing in Caen and management in Nijmegen and San Jose! Responsible for qualifying new Bluetooth IoT products and technologies for the China-based former Quintic company, now PL W&F under NXP.

    • Principal Reliability Physics Engineer
      Nov 2009 - Oct 2015 · 6 yrs

  • Postdoc at Delft University of Technology
    May 1998 - Nov 2000 · 2 yrs 7 mos

    This introduction into the world of IC technology marked my switch from fundamental to applied research. As post-doc at DIMES, I successfully built and employed a setup to study the excimer-laser annealing of amorphous silicon films on glass wafers. The melting and recrystallization models I obtained supported my group in processing arrays of single-crystalline silicon islands on amorphous carriers. Ultimately, the ability to create such arrays allows for the processing of thin-film transistors with far superior performance for, e.g., active-matrix displays. Four publications with over 40 citations.