Nijmegen, Gelderland, Netherlands
35 years of experience in semiconductor production. Started as a failure analysis engineer for bipolar devices. Now process engineer and trainer for die bonding.
Managing & maintaining the ITEC world class workshop. Creating training material for ITEC die bonders. Give training to employees and customers.
Development of die bond processes. Implementation and introduction of die bond processes for mass production. Main occupation is die sorting taping, eutectic die bonding, etc.. Additionally development of trainings, manuals and machine integration (electronics). Prototype building, co-managing our Nijmegen workshop and storage.
Development of die bond processes. Implementation and introduction of die bond processes for mass production. Main occupation is die sorting taping. Additionally development of trainings, manuals and machine integration (electronics)
Development of wire bond processes. Implementation and introduction of wire bond processes for mass production
Customer complaint handling of UOC IC types. Registering, analysing and implementing solutions for customer complaints. In this function also acted as a customer liaison officer (ad interim).