Frank Danaher

Packaging Engineer at NXP Semiconductors

Greater Phoenix Area

About

Experience

  • Packaging Engineer at NXP Semiconductors
    Dec 2015 - Present · 10 yrs 7 mos

    Design and test new packaging solutions for RF power amplifiers.associated RF products.

  • Packaging Engineer at Freescale Semiconductor
    May 2000 - Dec 2015 · 15 yrs 8 mos

    Design and test for new and existing packaging solutions for RF power amplifiers.