Santa Clara, California, United States
Experienced Technology & Operation Executive with over 14 years in the advanced packaging industry. Strong technical background in product engineering and process development. Well seasoned in business development with an entrepreneurial vision. Highly skilled leader of production & development teams in the US and Asia including supervision of technical sales & marketing. Thorsten Teutsch is a native German and holds a masters degree in Physics and a doctorate in Physical Chemistry. He worked as a department head for wafer scale packaging before he moved to the US and took over as president for Pac Tech USA in 2005. Specialties: Plant & Operations Management, Process Development to high volume manufacturing, Technology Transfer, Customer Service, Supply Chain Management, Cost Reduction; Yield/Productivity Improvement.
Advanced Semiconductor Packaging Equipment & Manufacturing Services
Double assignment together with my current function as president of Pac Tech's US operations which includes a 2 year relocation to Penang, Malaysia.
Responsible for all aspects of Pac Tech USA's operation, including subcontractor manufacturing processes, logistic & supply chain operations, process development and technology transfer, equipment sales & service, sales & marketing, budget forecast.
Responsible for Pac Tech USA's subcontractor manufacturing operation including process development and technology transfer.
Responsible for implementation of Pac Tech's low cost wafer bumping processes at the Nauen (Germany) facility, process development and technology transfer.