Königsbrunn, Bavaria, Germany
Leading an Engineering Team of Application Engineers, Test Engineers and Laboratory Assistants in the strategic field of Advanced Packaging Solutions (Semiconductor/ MEMS packaging/ FOWLP). Close customer support for adhesive applications; Engineering expertise for mass production processes. Development of measurement methods, mechanical analysis of adhesives and testing of bonded packages. Support of product managers, business developers and sales engineers worldwide.
Strategic fields: Advanced Packaging Solutions (Semiconductor/ MEMS packaging), HDD, RFID, Smart Card Close customer support for adhesive applications; Engineering expertise for mass production processes. Development of measurement methods, mechanical analysis of adhesives. Support of product managers, business developers and sales engineers worldwide
Coating of medical implants with wear-resistant and anti-microbial diamond-like carbon (DLC) containing silver nano particles. Process knowledge in plasma immersion ion implantation (PIII), analysis with Raman spectrocopy, nanoindentation, (E)SEM.