Singapore
As the Director and Head of Automotive Quality Management for Asia Pacific at Infineon Technologies, I am responsible for ensuring the highest quality standards and performance for our global customers in the automotive semiconductor industry. Experienced in managing the full spectrum of Quality Management System (QMS) and currently lead a team of Customer Quality Managers across Singapore, Korea, India and drive the quality strategy and service improvement for the region. I also enable Infineon's quality leadership and zero-defect mindset by implementing continuous improvement programs and industry best practices. I'm driven by a customer-centric approach in my work, where I advocate for the customer focus and strive to enhance their overall experience. This entails listening to their feedback, gaining a deep understanding of their needs and leveraging insights to implement meaningful improvements within the organization. With a strong background in good manufacturing practices, operations, process engineering, semiconductor assembly and testing, power module manufacturing, OSAT management and a passion for delivering best-in-class quality management systems (QMS), i am dedicated to delivering business results that drive revenue and success. I’ve had the pleasure to live and work in Malaysia, Singapore and Hungary, which has broadened my people management, leadership and cultural horizons.
Responsible for overall Automotive semiconductor quality in Asia Pacific region, enabling Infineon’s quality leadership of global automotive semiconductor business. Leading a team of Customer Quality Managers in Singapore, Korea and India for exceptional automotive quality and zero defect mindset. Defining, developing and executing automotive quality strategy and service improvement for Asia Pacific region while driving continuous improvement programs to ensure exceptional quality performance for our global customers. Serving as primary quality contact for customers (automotive OEMs/Tier 1s) for escalations, quality performance reviews and audits. Lead and coordinate cross functional teams in root cause analysis (RCA), corrective and preventive actions (CAPA) and follow through to resolution.
Spearheaded comprehensive quality assurance for IGBT Power Module assembly and testing, Orchestrated and advanced the Quality Management Systems (QMS), Quality Engineering (QE), and Material Quality Assurance (MQA) and Customer Quality. Directed the Test Technology and Innovation department in Cegléd, Hungary. Held strategic and tactical responsibilities for the implementation of quality strategies and continuous improvement within the manufacturing plant. Enhanced manufacturing quality levels of power modules, guaranteed compliance with ISO/IATF 16949 standards and fostered a Zero-Defect mindset through the development and implementation of company-wide quality initiatives. Strategic and tactical responsibility for implementing Quality strategy to fulfil customer needs and expectations. Improving semiconductor power modules manufacturing quality levels, ensuring compliance to ISO/ IATF 16949 standards, driving Continuous Improvement Programs (CIP) and instilling Zero Defect mindset by developing and implementing factory wide quality initiatives. Providing clear leadership and vision, inspiring teams to achieve excellence and mentor them as they develop new skills. Monitor and report Key Performance Indicators across all areas of the business to ensure that all projects are delivered on cost and on time to the highest quality standards.
Responsible for quality within Infineon’s Back-end manufacturing. Driving quality through effective process automation and digitalization, enabling assembly processes and products with greater uniformity and conformity to requirements. Establishing areas for improvement within operations, governance of non-conformance and strategizing preventive measures for sustainable product and process improvements. Responsible for defining, developing and maintaining quality firewall strategy to ensure highest outgoing product quality across back-end manufacturing sites in Singapore, Malacca-Malaysia, Batam-Indonesia, Wuxi-China, Warstein-Germany and Cegled-Hungary. Certified Global Change Management Trainer.
Responsible for driving Automotive Business Unit Operations and Quality within Asia Pacific. Tactical responsibility to guarantee semiconductor devices are manufactured with the correct automotive standards, robust assembly and packaging processes, product quality, on time delivery and with optimum cost for both ST and Outsourced Semiconductor Assembly and Test (OSAT) in Malaysia, Singapore, Philippines and Taiwan. To guarantee exceptional Quality and Operational excellence to our global customers. Ensuring compliance to ISO/ TS16949 Automotive Standard, reviews and resolves quality concerns including outsourced suppliers, vendors and managing automotive customers. Randomly inspects and verifies quality control checks for conformance to prescribed standards and develops corrective action plans and ensures timely resolution of findings. 2013/14 Global Lead for Automotive Back-end MRB encompassing back-end sites in ST Muar- Malaysia, ST Calamba - Philippines, ST Shenzhen- China, ST Bouskoura- Morocco, ST Malta and Subcons in Asia Pacific region.
Responsible for Front-of-Line semiconductor assembly processes, developing and maintaining operational procedures for high volume production and executing detailed root cause analysis for non-conforming lots. Working closely with cross-functional engineering and manufacturing teams for new product introductions, defining critical design rules, qualification of materials, tooling and equipment. Developing technical roadmaps for process development, identifying risks and work on technical solutions. Responsible for process and product transfers to production include assisting with FMEA’s, the generation of SOP, control plans and work instructions required to define assembly processes and training associated with specifications. Create, conduct, & analyze Design of Experiments (DOE) for development to high volume semiconductor microelectronics production. Responsible for providing technical solutions to resolve critical and chronic assembly & packaging process and product issues in Back-end semiconductor manufacturing. Establishing and standardizing plant-wide process control requirements, responsible for process, quality and productivity improvement projects. Evaluate and develop new assembly materials/design and perform qualification for mass volume production. Spearhead operations in cost reduction programs through material, equipment and process simplification. Ensure yield improvements, PPM reduction and quality incident elimination to achieve ZERO defects. Appointed Bosch Synergy Team CIP Leader - with responsibility to deliver exceptional automotive quality, with compliance to Bosch requirements.