Singapore
- Responsible for integrating semiconductor process modules across front-end manufacturing to ensure device performance, yield, and reliability. - Worked closely with process, equipment, and yield teams to troubleshoot inline and electrical issues, drive defect reduction, and support technology qualification and production ramp-up. - Involved in failure analysis, process optimization, and cross-functional coordination to meet manufacturing and quality targets.
To develop a comprehensive advanced 3nm FinFET semiconductor devices stress methodology and assessment for HTOL readiness and product reliability improvement. • Test program development, testing debugging, pre- and post-analyses for HTOL. • HTOL readiness management and execution. • HTOL test program development and debug. • HTOL hardware design bring-up, evaluation and improvement. • Product reliability degradation computation and key analysis techniques. • Process automation opportunity. • Success of test bring-up on a 3nm/5nm product silicon qualification.