Grenoble, Auvergne-Rhône-Alpes, France
Focus on development & adoption of Process Control solution for Semiconductor Industry since 2001. Specialist of Advanced Packaging (FOWLP/FIWLP, 3D/2.5D, COWOS, SIP) Liason with International Branch offices. Coordinator of Joint Development Projects in collaboration with either production facilities or R&D centers and responsible for Tier1 customers. Managing team of 30 application engineers world-wide located. Responsible for P&L & Product Roadmaps Conference Speaker with 40+ scientific/technical papers & articled published Specialties: -Market Analysis -Customer Analysis & Strategic Selling -Project management with multi-disciplinary competences -Strong relationships with final customers -Good knowledge of industry sales processes -Excellent technical and analytical skills -Ability to breakdown complex topics into feasible work packages -Proven oral and written communication skills -Product Management (PLC, P&L) -Technical liaison; Process Knowhow: -Semiconductors--> FEOL/BEOL, Backend (EWS, Bumping, Probing, Dicing, Bonding), Advanced packaging (FOWLP/FIWLP, 2.5D & 3D-IC) -Energy--> Li-ion batteries, Supercapacitors based on carbon materials -Biophysics/nanotechnologies--> Metallo-proteins, redox-centers, single-tunneling junctions, bio-sensors, Langmuir-Blodgett thin film deposition Technical skills: -Metal deposition (PVD, CVD, ALD, ECD) -Metrology Characterisation: Pump/Probe opto/acoustic techniques, Ellipsometry, Refractometry, Laser triangulation, Interferometry (White-light and IR), Confocal Microscopy, Scanning Probe Microcsopy (AFM, Conductive-AFM, LFM, STM); -Defect Inspection: Macro/Micro inspection based on Automatic Visual Detection in visible and infrared domain, Confocal Chromatic Microscopy, Phase Shift Deflectometry; sub-micron inspection based on light-scattering; -Data Analysis solutions: Yield management systems and Automatic Data Classification. -Electrochemistry: Cyclic Voltammetry, Impedance Spectroscopy
Following the acquisition of UnitySC, I am continuing my current responsibilities as part of the Electronics business of Merck within the Metrology & Inspection division
identification of customer need & corresponding solution in Unitysc products; responsible of customers worldwide applications support, demo and tool qualification services. Focus on value selling and strategic applications development & adoption
Business Unit P&L Team building & management Product Life Cycle
Product Manager for process control solutions in Advance Packaging Area Managing R&D program funded by public institutions and Joint Development Program in collaborations with key R&D center/Consortium or customers
Senior Applications Scientist working in Semiconductor Industry Main responsibilities & duties: -Joint Development Projects local coordinator & Technical liaison between company and industrial partners; -First contact point for major European customer; -Pre/Post sales applications support on Visual Inspection, data Analysis & Metrology product lines. Technical area of interest: -FSI & BSI image sensors, -2.5D silicon interposer, TSV & 3Di for Advanced Packaging technologies; -Blank Mask inspection for next generation lithography; -FrontEnd thickness characterization;
Electron transfer reactions investigation by Conductive Scanning Force Microscopy, Electrochemical controlled Scanning Tunnelling Microscopy and Cyclic Voltammetry. Activity cofounded by SAMBA European project
Expert in residence supporting STMicroelectronics customer on Metal characterization by opto/acoustic technique (MetaPULSE)