Daniel Hutchinson-Kausch

Wafer Process Engineer at Micross Advanced Interconnect Technology, NCSU Park Scholar Alumni

Greensboro, North Carolina, United States

About

Thoughtful hard-worker with a demonstrated history of working in both engineering and the online media industry. Skilled in Microelectronic Fabrication, Nanomaterials, Computer-Aided Design (CAD), Material Science, and 3D Printing. Strong engineering and media professional with a Bachelor of Applied Science - BASc focused in Materials Engineering from North Carolina State University.

Experience

  • Wafer Process Engineer at Micross Components
    Apr 2022 - Present · 4 yrs 4 mos

    Worked at an R&D-focused facility specializing in advanced packaging and 2.5/3D heterogeneous integration for a microelectronic devices. Experience with photolothigraphy, sputtering deposition, wet etching, reactive ion etching, advanced packaging, and electroplating techniques. Collaborated with other engineers to develop processing solutions for unique geometric and material structures that posed a wide variety of physical and chemical challenges. Took a lead role in wet processing and surface treatment. Managed some projects under the guidance of senior engineers.

  • Staff Writer at Vox Media, LLC.
    Jan 2020 - Present · 6 yrs 7 mos

    I work with a team of writers to provide breaking news coverage, game coverage, and original content on the Atlanta Braves, often from a statistical perspective

  • Engineering Intern at Alten USA
    May 2021 - Aug 2021 · 4 mos

    Designing, rapid-prototyping, and testing a high-precision automated dispensing system as requested by a client. I used CAD (CATIA), SLA and FDM 3D printing, and basic woodworking and metalworking on this project, as well as Excel to analyze test results. I was heavily involved in weekly meetings with the client communicating design progress, testing data, and future ideas.