Daniel Cheng

Columbia University Class of 2024

New York, New York, United States

About

Experience

  • Software Engineer Intern at Capital One
    Jun 2023 - Present · 3 yrs 1 mo

  • Research Intern at Columbia University
    May 2022 - Aug 2022 · 4 mos

    Construction and analysis of instrument measuring gold-gold tunnel junction and single molecule electroluminescence