Daniel C.

Sales & Marketing Manager

Kowloon, Hong Kong SAR

About

Experience Business and Market Development of Semiconductor/electronic materials,components & IC packaging (flip chip build-up substrate, SiP substrate, etc.) industry. Business development and Sales PIC of Construction Equipment Finance support of Hong Kong market. #semiconductor components #China and Taiwan Market #semiconductor packaging #electronics sales #business development #asia pacific exposure#ceramic package#buildup substrate#flip chip#optoelectronics #equipment finance#credit analysis#construction equipment #Industrial machinery

Experience

  • Manager South East Asia Sales Marketing Dept at Panasonic Ecology Systems
    Jan 2024 - Present · 2 yrs 6 mos

  • Sales Manager at Sumitomo Mitsui Finance and Leasing (Hong Kong) Limited
    May 2021 - Jan 2024 · 2 yrs 9 mos

  • Kyocera (Hong Kong) Sales & Trading Ltd. (Hong Kong SAR)
    • Deputy Sr. Sales Manager
      Apr 2014 - Feb 2022 · 7 yrs 11 mos

      a. Focus on China Market Development for organic product line (Flip chip FCBGA/FCCSP, SiP substrate ) b. Sales and Business development for China Region (ceramic products, ceramic package)

    • Marketing and Business Development Manager
      Jul 2013 - Mar 2014 · 9 mos

  • Kyocera Asia Pacific (7 yrs 11 mos)
    • Marketing and Business Development Manager, Semiconductor Components Division
      Apr 2012 - Jun 2013 · 1 yr 3 mos

    • Assistant Manager,Marketing and Business Development, Semiconductor Components Div.
      Apr 2008 - Mar 2012 · 4 yrs

      Business Development for Semiconductor Components /Packaging Solutions

    • Marketing Specialist
      Aug 2005 - Mar 2008 · 2 yrs 8 mos

      Focus on the RF module substrate promotion for China and Taiwan Region

  • Executive at SEI Interconnect Products
    2001 - 2005 · 4 yrs

    Taiwan key accounts, distributors management and new business development