San Francisco Bay Area
• In-depth knowledge in : chemical and materials engineering; polymer science and engineering; surface science and adhesion; •Extensive technical experience in: polymers in general; failure analysis; surface cleaning and pretreatment; materials and surface analysis ((TOF-SIMS, AFM, Raman, FTIR, XPS, AES/SEM, etc); wafer fab processes; MEMS; photolithography, xerolithography, and nanoimprint lithography; electrochemistry and corrosion control; formulation and performance evaluation of specialty polymers such as adhesives and photoresists; experimental design techniques (Taguchi, YB Six Sigma); project management. • excel in materials physical/chemical characterization>mechanism or root cause>novel solutions • key professional traits: passion, responsibility, integrity, innovative, problem solver, driven, results oriented, capable leader. • Original inventor of a novel eco-friendly metal surface pretreatment (“revolutionary" by some) that has replaced traditional chromating and phosphating in relevant industries such as automotive (leaded to Oxsilan, currently owned by BASF). Patented 3D-IC temporary wafer bonding adhesives and potentially field-disruptive chemical mechanical debonding technique
Passionate Materials Scientist specialized in materials analysis, wafer process and materials-wet chemistry, MEMS, temporary wafer handling in 3D-IC, and polymers (adhesives, thin films, coatings), *worked as a cofounder/CTO in launching a polymer materials startup for one year, *worked as a consultant on semiconductor or MEMS wafer processing and wet chemicals. *Worked as a startup founder and CEO on the development and commercialization of patented 3D-IC temporary wafer debonding technology and adhesives; have successfully developed the prototype of super thin wire or tape based debonding method and equipment in 2025 with patent granted and PCT filing in progress-1st in the world!
MEMS type wafer level materials and processes, wafer fab process development, volume manufacturing, wet process, failure analysis, metrology, tool qualification, process problem solving and integration, metal liftoff, cleaning, RIE, plasma ashing, thin films，surface analysis, magnetic sensor
conductive polymer formulations: consulting to solve important technical challenges. MEM electronic materials IP
materials and processes, thin solar wafer backend process management: polymer temporary wafer bonding adhesives, wafer level packaging, wafer cleaning, etching and bonding. Patent filing. supervising personnel and coordination.
advanced materials and processes in nanofabrication: R&D of Patterned Media via nanoimprint lithography, plasma, etching. polymer thin films, failure analysis and quality evaluation. invention disclosures and patents.