Bayan Lepas, Penang, Malaysia
Product Manager VAT Group | Current • Strong exposure in product lifecycle management, product strategy, and market analysis. • Skilled in identifying market opportunities and driving business growth through technical and commercial alignment. • Strong experience in cross-functional collaboration with engineering, sales, operations, and global stakeholders. • Experienced in customer engagement, strategic planning, and supporting product commercialization activities. • Passionate about technology, innovation, and delivering customer-focused solutions to improve market competitiveness. Senior Process & Equipment Engineer Intel Corporation | Year 2018– Year 2026 • Specialized in STIM (Solder Thermal Interface Material) and PTIM (Polymer Thermal Interface Material) processes for semiconductor package assembly and reliability improvement. • Investigated and resolved reliability issues related to small and large die products, including thermal fatigue cracking of indium during thermal cycling. • Analyzed void formation within TIM joints that contributed to increased local thermal resistance and degradation of thermal performance. • Evaluated interfacial reactions between IHS surface finishes and backside metallization (BSM) on silicon dies. • Supported indium STIM reflow process optimization to achieve uniform intermetallic compound (IMC) formation post-assembly. • Performed package warpage and thermo-mechanical behavior analysis, identifying die thickness as a key contributor to dynamic package warpage. • Collaborated closely with process, equipment, materials, and reliability engineering teams to improve manufacturing stability and product performance. • Supported process optimization, yield improvement, root cause analysis, and reliability enhancement activities for advanced semiconductor packaging.
• Support sales organization in regards to all technical and operational aspects. • Driving the corporate strategy through a globally matrixed team across multiple functions. • Proven knowledge to monitor the profitability of existing customer products and deriving measure in order to sustain and increase the profitability. • Accountable for customization and industrialization projects and technical customer documentation like manuals, product data sheets. • Coordination of customer visits, audits and customer specific requirements across the business units and legal entities for implementation into engineering and operational processes. • Supervising all changes in regards to supply chain, manufacturing and assembly processes and preparing documentation for customer relevant changes and submitting it to the respective customers following the customer specific change management process. • Conduct market analysis, competitor benchmarking, and customer engagement to identify growth opportunities. • Manage product lifecycle, pricing strategy, and product positioning to strengthen market competitiveness. • Led and supported spare parts relocation activities from Switzerland to Malaysia to improve operational efficiency and drive cost-saving initiatives.
• Involved in Intel most advanced chips with advanced co-EMIB (Foveros 3D stacking + EMIB) package technology NPI transfer with overcame multiple challenges and product complexity through strong collaboration with Assembly Test Technology Development. Travelled to Arizona, US for the product transfer. • Certified training in analysis methods, system operation and data interpretation on Nordson SONOSCAN DF2400i C-Mode Scanning Acoustic Microscope. • Initiate and execute process improvements contributing to overall manufacturing productivity and cost competitiveness. • Develop procedures and checklists for maintenance, equipment or process qualification and reaction mechanisms. • Analyze process data and conduct experiments to optimize process conditions. • Participate in quality focused meetings to help the area reduce scrap and excursions, improve quality and maximize yield. • Troubleshoot process failures and implement robust and effective solutions to address process and equipment issues. • Partner with respective Technology Development site and other factories counterpart to develop, startup, improve and define the critical equipment and process parameters to enable a successful startup and ramp of the factory. • Involve in cost-saving project with $1.3M saving for galden leakage failure by enable heater block rework with tester kit development. • Provide equipment safety checklist to assess whether the equipment meets safety and quality standards before being used. • NPI products startup from NPI to HVM, ramped 5 products (10 favors). • Ensure all gaps closed within NPI stages including PCS, Collateral, Recipe, Yield performance, COD & technical gaps while maintain CE parameters. • Improve NPI product yield from 99.75% to 99.93% through deep dive understanding on process/technical variation and come out with solution including collateral modification & recipe optimization. • Familiar data analysis tool, including SQL, JMP, PCS,FMEA for yield/quality improvement.
During my internship at AEM Microtronics, I was attached to the Quality Assurance and Quality Control department. My responsibilities included assisting in updating records and manuals in line with established requirements and procedures, preparing inspection reports and labels, and supporting first-piece and in-process inspections for metal stamping parts. I gained hands-on experience using various measuring instruments such as digital calipers, digital micrometers, thread gauges, profile projectors, height gauges, OGP SmartScope, and coordinate measuring machines (CMM). Additionally, I learned how to perform START and END operations for quality inspections using EMS Evertech software. These operations were applied across several processes, including surface treatment, Tsugami machining, QA/QC inspection, CNC machining, and EDM. For products with defects such as rust, dents, out-of-tolerance dimensions, incorrect engraving, uneven color, or surface scratches, I was responsible for completing non-conformance product reports.