Chien Chen Lee

VP, BU Head, Tong Hsing Electronic Industries.

Hsinchu City, Taiwan, Taiwan

About

Chien Chen Lee (李建成) • OSAT BU Head, CTO, P&L Management • 25+ years of IC Packaging Engineering and the Manufacturing Operations in OSAT and Fabless. • CIS (CMOS Image Sensor), MEMS, Flip Chip, WLCSP, SiP (System in Package), PA (Power Amplifier) module, FEM (finite element modeling) • Published 20+ Journal/Conference papers. • Hold 100+ patents granted. Ph.D., Power Mechanical Engineering, National Tsing Hua University, Taiwan

Experience

  • VP, BU Head at Tong Hsing Electronic Industries
    Jul 2022 - Present · 4 yrs

  • CTO, BU Head at Kingpak Technology
    Apr 2018 - Jun 2022 · 4 yrs 3 mos

  • Director of Packaging at Mcube Inc
    Aug 2012 - Apr 2018 · 5 yrs 9 mos

  • Director of R&D at STATS ChipPAC
    May 2010 - Aug 2012 · 2 yrs 4 mos