Benjamin Sigel

Head of Service Infrastructure and Training bei ZEISS Semiconductor Manufacturing Technology

Germany

About

Experience

  • ZEISS Semiconductor Manufacturing Technology (Full-time · 4 yrs 11 mos)
    • Head of Service Infrastructure and Training
      Feb 2025 - Present · 1 yr 6 mos

    • Head of Customer Fieldservice worldwide
      Sep 2021 - Jun 2025 · 3 yrs 10 mos

  • Head of Customer FieldService worldwide at ZEISS Group
    Sep 2021 - Jun 2025 · 3 yrs 10 mos