San Jose, California, United States
I’m Co-Founder and CTO of SixSense, building AI for yield engineering in semiconductor manufacturing. Our platform acts as an AI layer on top of inspection systems, turning defect images, wafer maps and process history into real-time yield intelligence — from automated defect classification to excursion detection and root-cause traceability. Over the past 7+ years, SixSense solutions have been deployed at leading wafer fabs and OSATs across Taiwan, Malaysia, Singapore, Israel, and the United States, including companies such as GlobalFoundries, Raytek, and STATS ChipPAC, along with multiple CIS OSATs, compound semiconductor fabs, specialty foundries, and advanced packaging manufacturers. Our software integrates with major inspection platforms including AMAT, KLA, Onto Innovation, and Camtek, across FEOL, BEOL, wafer probe, and advanced packaging environments. We work closely with yield and process teams to help detect systematic yield drops early, reduce wafer exposure during excursions, and accelerate root-cause analysis. SixSense is OEM-agnostic and designed to enhance existing inspection infrastructure without hardware changes. Recognised among Singapore’s 100 Women in Tech and Forbes 30 Under 30.
SixSense builds AI systems that reduce wafer exposure and accelerate root cause analysis in semiconductor Wafer Fabs and Assembly and Test. We turn inspection, metrology and test signals into early containment intelligence, helping fabs minimise the combined cost of wafer exposure and containment. We specialise in products such as AI-ADC (AI-powered automated defect classification for optical and SEM inspection images), and early detection and traceability systems that identify systemic wafer patterns and isolate suspect tools before yield incidents escalate.
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