Arnaud Glais

Image Sensor Digital team manager - at STMicroelectronics

France

About

20+ years of experience within high technology companies since my engineering degree in 1999 (Central Marseille) from spatial domain to the computer field and now for 20 years in imaging area developing new silicon devices for end applications like automotive or consumer field. Experienced digital and embedded software engineer with a strong focus on system level understanding, I am currently leading development of silicon devices in Imaging field. This position allows me to use my organization skills for project management role as well as using my technical expertise to lead the design team. International experiences are important for me, I've been working in the past in California-US as well as Edinburgh in UK. While based in France for more than 15 years, I've been working with multi international design centers. Since August 2019 I've been proposed an expatriate position in Singapore to lead the development of imaging devices designed by local teams to reach best in class products. Technical know-how: Imaging devices architectures, Digital Design, Embedded Software, Silicon design steps and challenges, Result orientated with a strong focus on problem solving. Project Management know-how: Project Plan follow-up, Design Progress reporting, DFMEA methodology, Design Reviews lead, Requirement management traceability

Experience

  • STMicroelectronics (25 yrs 8 mos)
    • Image Sensor Digital team Manager
      Aug 2022 - Present · 3 yrs 11 mos

      In charge of a team of image sensor digital IC designers. From initial customer product request to silicon delivery.

    • Imaging Design Technical Manager
      Aug 2019 - Aug 2022 · 3 yrs 1 mo

      Responsible of the design of imaging devices developed by the Singapore Imaging design team. From marketing or customer requirement specification to device bring-up and support of the industrialization up to mass production. In charge of leading the design team to fulfill specification requirements and reach the smallest die size within the agreed schedule for time to market challenge. During design phase: - Leading a technical core team of multi skill engineers made up of digital, analog architects and designers, layout and physical implementation engineers and embedded firmware engineers - Ensure proper project management activities like DFMEA, design reviews, requirement management traceability - Provide clear reporting of design progress to division staff and business line device sponsor - Accountable for the design schedule and chip size requirement During silicon validation up to mass production: - Silicon design entry point to wafer testing, reliability, application and validation teams - Accountable to internal and external audit of product development process for silicon design field

    • Imaging Design Technical Manager
      Oct 2012 - Jul 2019 · 6 yrs 10 mos

      Responsible of the design of imaging devices. From marketing or customer requirement specification to device bring-up and support of the industrialization up to mass production. I have been managing the development of multi imaging chips with ST teams on multi sites with external subcontractors as well as design partners. During design phase: - Leading a technical core team of multi skill engineers made up of digital, analog architects and designers, layout and physical implementation engineers and embedded firmware engineers - Ensure proper project management activities like DFMEA, design reviews, requirement management traceability - Provide clear reporting of design progress to division staff and business line device sponsor - Accountable for the design schedule and chip size requirement During silicon validation up to mass production: - Silicon design entry point to wafer testing, reliability, application and validation teams - Accountable to internal and external audit of product development process for silicon design field Achievements: - leading some key design activities on top runner business product of the division with deep customer interactions - leading multi generations of automotive imaging devices embedding challenging safety topics aligned with ISO26262 automotive safety requirements

  • Software Engineer in Design For Test team at Intel Corporation
    Mar 2000 - Sep 2000 · 7 mos

    Internship. C/C++ development of tool aiming at improving the design for test of new CPU

  • Research student at Centre National d'Études Spatiales
    Jul 1998 - Nov 1998 · 5 mos

    Internship on Micro-Electro-Mechanical Systems power supply • Published report on state of the art on the high voltage transformers • Development of an experimental macro piezoelectric transformer