Belgium
I am a detail-oriented and analytical Product Development professional specialized in electrically conductive adhesives and advanced acrylate and epoxy systems for electronics applications. I combine formulation expertise with hands-on laboratory execution and performance validation according to customer specifications. I started my career at Henkel Electronics in Westerlo (Belgium), focusing on solar and electronic adhesive applications as well in circuit board protection and printed electronics. My core responsibilities include the formulation and optimization of epoxy- and acrylate-based conductive systems, balancing resin chemistry, filler architecture, and cure behavior to meet demanding electrical and mechanical targets. My technical expertise includes: Formulation design and optimization Filler workpackage adjustments (flake/spherical blends, loading optimization) Jet dispensing and application-related evaluation Speedmixing and propeller mixing techniques Preparation of customer samples Equipment monitoring and laboratory process control Performance evaluation and characterization: Viscosity (low & high shear) Differential Scanning Calorimetry (DSC) Dynamic Mechanical Analysis (DMA) Volume resistivity & contact resistivity Die shear strength & peel adhesion Hegman gauge (dispersion quality) Density measurements Currently working at the Henkel Innovation Center in Düsseldorf, I contribute to next-generation low-temperature curing and high-performance conductive adhesive systems. My focus lies in understanding the interaction between resin matrix design, accelerator chemistry, filler morphology, and final functional performance. I am particularly driven by translating material chemistry into measurable application performance under real customer conditions.