Rochester, New York, United States
5th year BS/MS (Microelectronic Eng. / Electrical Eng.) Student attending Rochester Institute of Technology.
Enabled the success of students by explaining relevant course material and providing feedback on assignments.
• Identified a root cause and developed working theory for the second root cause of reduced product yield using statistical and commonality analyses through internal TI software. Suggested corrective action to mitigate source of reduced yield. • Saved over $100K annually by removing redundant process steps; conducted statistical analysis of parametric and yield data to verify changes were comparable to baseline. Conducted supplementary checks and presented findings to review board. • Reduced disposition time of lots failing electrical test by introducing an automated report comparing the lot to baseline data. • Verified product line integrity by collaborating with team to isolate problem lots and generate product stability reports.
Enabled the success of students by explaining relevant course material and providing feedback on assignments.
• Led project to analyze the standard responses taken to recover a chamber from failing particle scan. Utilizing JMP to compile raw data into a table, performed analysis on the created data set and generated recommendations for improvements to decrease the time chambers stayed down. o As a result of this project, generated a table of known root causes corresponding to specific defect GFAs. • Led cost reduction project to implement alternative source parts for use in chambers. Utilized JMP to analyze data metrics to verify components were safe to implement in all chambers. About $3000 saved per standard maintenance. • Drove sustaining excellence by aiding team in tool ownership, troubleshooting down tools through data analysis and utilizing six sigma methodology, and helping manage defect issues and responses. • Utilized python skills to generate automated reports to save engineers time (~2hr weekly) and improve daily sustaining. • Analyzed effectiveness of a tool health monitor run post elevated defect response. Utilized JMP to investigate the corresponding estimated impact on die with that monitor, which led to a proposal to eliminate the monitor due to its ineffectiveness to accurately represent the chamber state.