Lappersdorf, Bavaria, Germany
Developing new MEMS technologies to extend capabilities and performance of sensors. Working with diverse cross-functional and global teams, aligning with stakeholders to achieve common goals.
Developed wafer technology modules for MEMS sensors, image sensors, and AR/VR devices on four different IFX front-end production sites. Led two projects developing new MEMS technologies from idea to mass production, contributed as technology expert to platform development teams.
Led projects in epitaxy process development and factory integration, from innovation phase to mass production. Contributing to performance improvements and cost down of high-power optoelectronics product platform.
Process development InGaN metal-organic vapor phase epitaxy for optoelectronics devices.