Alex Hempel

Electrical Engineer - Non-Destructive Testing

Cincinnati, Ohio, United States

About

Electrical Engineer with five years of electronic and product design experience. B.S.E.C.E The Ohio State University. Areas of expertise include circuit design and PCB Layout, high-speed digital design, analog design, audio electronics, hardware verification and testing, production test automation systems, LabVIEW development, 3D modeling, 3D printing, AV systems and integration. Highly proficient in Altium Designer, OrCAD, Eagle, KiCAD, SolidWorks, and LabVIEW. Proficient in embedded C/C++ for Atmel/Microchip devices. Highly proficient in the use of electronic test equipment, circuit board rework, and prototyping.

Experience

  • Electrical Engineer at TPAC
    Feb 2025 - Present · 1 yr 6 mos

  • Field Engineer at Daktronics
    Dec 2023 - Jan 2025 · 1 yr 2 mos

    Successfully completed multiple complex display, scoring, and audio installations simultaneously in a wide variety of environments with tight schedules. Coordinated with general contractors, installers, electricians, system integrators, IT specialists, and site managers to ensure the correct installation of displays, scoreboards, PAs, contactor and breaker panels, signal wire, and fiber optic cable. Provided on-site and remote technical services for control, display, and audio systems. Provided the end user training on the use of their equipment. Provided day-of event support for customers events such as the Cincinnati Reds, Cincinnati Bengals, Dayton Dragons, University of Dayton, and University of Cincinnati.

  • Freelance Product Design Engineer at Self Employed
    Feb 2021 - Jan 2025 · 4 yrs

    • Developed working prototypes and production ready products for various concepts ranging from IoT connected pet food dispensers to GSM enabled asset tracking devices • Utilized electrical simulation tools to develop analog and digital circuits • Designed schematics, layout, and fabrication documents for prototypes and production • Designed mechanical enclosures and parts to fit the requirements of each project • Utilized FDM and DLP 3D printing technologies to prototype enclosures and functional parts

  • Tech4Imaging ()
    • Electrical Engineer
      Dec 2019 - Jan 2021 · 1 yr 2 mos

      • Designed custom mixed signal hardware for proprietary 4th generation ECVT Data Acquisition System and 2nd generation Adaptive ECVT Data Acquisition System (schematics, layout, fabrication and assembly documentation) • Tested, debugged, and validated prototype hardware, software, and firmware • Ensured products met CISPR/FCC EMC and environmental regulations • Facilitated fabrication and assembly of prototype and production units with manufacturers • Developed technical documentation such as scopes of work, hardware specifications, assembly drawings, Bills of Materials, and test reports

    • Electrical Engineering Intern
      Mar 2019 - Dec 2019 · 10 mos

  • Audiovisual Student Manager at The Ohio State University
    Aug 2014 - Mar 2019 · 4 yrs 8 mos

    I assist clients with their audiovisual needs. These responsibilities include running lighting and audio boards for events and working with the clients to ensure that their needs are being met. As student manager, I supervise the work of other AV employees and make sure they are keeping on task and assist them in solving any problems they may encounter.