Arnhem-Nijmegen Region
Product Lead Engineer – In-Vehicle Networking | Semiconductor Expert | Zero-Defect Expert: Currently driving New Product and Technology Introduction for high-reliability In-Vehicle Networking solutions in the automotive sector. I focus on industrial producibility to achieve 0 ppb defect rates in high-volume production by the most advanced Zero-Defect methodologies — ensuring the robustness required for mission-critical automotive applications. With a strong foundation in semiconductor device physics and process integration, I act as a natural bridge between IC designers and wafer fabs, collaborating across multiple disciplines like Test Engineering, Failure Analysis, Quality, and Customer Support to deliver scalable, high-yield and high-realible solutions. Data Analyst & Machine Learning Developer: Applying Python to optimize test flows, analyze parametric and reliability test data, and build predictive models for high quality manufacturing. Past experiences: Device Physicist: Led development of embedded Non-Volatile Memory in advanced CMOS nodes and RF BiCMOS technologies (SiGe HBT, PIN, NMOS Switch). Expert in Device Characterizations, 2D/3D TCAD Simulations, Process Integration, and Reliability.
Product line In-Vehicle Networking, BU Automotive New Product and Technology Introduction for high-reliability In-Vehicle Networking solutions in the automotive sector Data Analyst & Machine Learning Developer Zero-Defect Expert
Design and development of SiGe HBT BiCMOS technology for RF applications. Design and development of embedded Non-Volatile Memory and advanced CMOS. TCAD expert. Characterization and modeling of IC technologies. Process Integration. Support IC designers, technologists, and reliability engineers concerning device physical matters.
Post-Doc Research in Solid-State Lighting
Development of Ph.D.